NXP Semiconductors Power Management ICs 2,400+

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Part RoHS Manufacturer Other IC type Temperature Grade No. of Terminals Package Code Package Shape Surface Mount Total Dose (V) Maximum Switching Frequency Package Body Material Maximum Supply Current (Isup) Maximum Output Current Trim or Adjustable Output (V) No. of Functions No. of Channels Technology Screening Level Nominal Bandwidth Terminal Form Main Out Ripple Voltage Control Technique Nominal Negative Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Power Supplies (V) Switcher Config Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Output Voltage Control Mode Protection(s) Maximum Total Power Output Minimum Operating Temperature Terminal Finish Maximum Output Voltage Terminal Position JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width (mm) Qualification Normal Position (V) Minimum Supply Voltage (Vsup) Nominal Input Voltage Additional Features Minimum Input Voltage Maximum Negative Input Voltage JESD-609 Code Switching (V) Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Maximum Switch-on Time Maximum On-state Resistance (Ron) Nominal Threshold Voltage (V) Length Adjustable Threshold Nominal Output Voltage Maximum Input Voltage

935320745557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

MCZ33904B3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935377557528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935371912557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935318437557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935371917528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935313439147

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935312667557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935316245557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

3

40

260

935320741557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935344309557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935312304528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935371922557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935371928528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935384682557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935312927528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935318531518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

MCZ33903DP3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

935324942557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935313147557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935333161574

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

MCZ33905CD3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

54

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G54

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

17.9 mm

YES

935312979518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935359123557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MCZ33904C5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

935358987528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935307252528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MC13892FJVKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

3

40

260

935333193574

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935374896012

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935310712564

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935384679557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935320821557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935361506118

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935369039557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MF1S5000XDA4/V1J

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

OTHER

16

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

NO LEAD

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

R-PXMA-N16

NOT SPECIFIED

NOT SPECIFIED

NO

MCZ33905S5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935385549557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935287838518

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

AUTOMOTIVE

16

SOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

11 V

SMALL OUTLINE

1.27 mm

150 Cel

-40 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

10.3 mm

NO

935315635528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935316263557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935384743557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935313089557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

3

40

260

935317731557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MC13892DJVKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

INDUSTRIAL

139

TFBGA

SQUARE

YES

PLASTIC/EPOXY

1.5 mA

1

1

BALL

3.6 V

3.6

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA139,13X13,20

Power Management Circuits

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B139

3

3.6 V

1.2 mm

7 mm

Not Qualified

1.8 V

e1

40

260

7 mm

YES

935306667528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

935370637528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935313148557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.