NXP Semiconductors Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Adjustable Threshold
935306518518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MF1S5031XDUD,005	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER		DIE	RECTANGULAR	YES	UNSPECIFIED		1	1		NO LEAD		UNCASED CHIP			70 Cel	-25 Cel		UPPER	R-XUUC-N												NO
935369037528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935317536518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN SILVER			3							e2	40	260
935371715557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		NICKEL PALLADIUM GOLD			3							e4	40	260
MC13892EJVL	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																					3								40	260
935315689557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
935315651528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935318606557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
MCZ33903CS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
935333189574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935316263528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
MCZ33903DD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
935310942574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935315635557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																					3								40	260
935313015557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
935310717518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN SILVER COPPER			3							e1	40	260
935315475528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935333202574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935307826012	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935306516518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935333155574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935376928557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935318562528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
MPC18730EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	COMMERCIAL	64	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	18 mA	1	9		NO LEAD	1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	.5 mm	65 Cel	-10 Cel		QUAD	S-PQCC-N64		2.2 V	.9 mm	9 mm		.9 V	IT ASLO HAS 2.7V TO 4.2V SUPPLY				9 mm	YES
MCZ33905D5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G54		28 V	2.45 mm	7.5 mm		5.5 V					17.9 mm	YES
935312511528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
935383505557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MCZ33904B5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MF1S5001XDUD	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER		DIE	UNSPECIFIED	YES	UNSPECIFIED		1	1		NO LEAD		UNCASED CHIP			70 Cel	-25 Cel		UPPER	X-XUUC-N					Not Qualified							NO
MF1S5000XDA4	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	16		RECTANGULAR	YES	PLASTIC/EPOXY		1	1		NO LEAD		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED	R-PXMA-N16	NOT APPLICABLE				Not Qualified				NOT SPECIFIED	NOT SPECIFIED		NO
MCZ33903CS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
935354251528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935310933518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935320729557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935322082557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935310717557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN SILVER COPPER			3							e1	40	260
935319854574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935315905557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935382397528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3							e3	40	260
935321856557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935323737557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935374229118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
MF1S5000XDA4,118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	16		RECTANGULAR	YES	PLASTIC/EPOXY		1	1		NO LEAD		MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel	Silver (Ag)	UNSPECIFIED	R-PXMA-N16								e4				NO
MCZ33904A3EK/R2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		27 V	2.45 mm	7.5 mm	Not Qualified	5.5 V					11 mm	NO
935315077528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935320458528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																		TIN			3							e3	40	260
MCZ33904C3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.