Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Broadcom |
BUS CONTROLLER, PCI |
GULL WING |
136 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
CMOS |
I2C |
S-PQFP-G136 |
3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
85 Cel |
625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N56 |
e3 |
|||||||||||||||||||||||||||||
|
Exar |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.4 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
5 V |
I2C |
.5 mm |
S-XQCC-N32 |
IEEE 802.3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.8 V |
70 Cel |
0 Cel |
GOLD |
QUAD |
1.6 mm |
7 mm |
ALSO OPERATES AT 27 MHZ OR 48 MHZ CLOCK FREQUENCY |
0 |
12 MHz |
7 mm |
CMOS |
99.78 mA |
3.3 V |
Bus Controllers |
I2C |
.5 mm |
S-PQFP-G48 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
1311 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B1311 |
|||||||||||||||||||||||||||||||||||||||||||
|
Siemens |
BUS CONTROLLER, MULTIBUS |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
FLATPACK |
4.5 V |
85 Cel |
-40 Cel |
QUAD |
2.35 mm |
10 mm |
ALSO AVILABLE ST AND AMI |
8 |
48 MHz |
10 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G44 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
4 V |
70 Cel |
.1875 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
NO |
DUAL |
NO |
2.794 mm |
8192 |
7.5057 mm |
0 |
6 MHz |
20 |
260 |
15.875 mm |
256 |
CMOS |
40 mA |
4.35 V |
NO |
Microcontrollers |
OTPROM |
USB |
.635 mm |
R-PDSO-G48 |
3 |
Not Qualified |
12 rpm |
e4 |
32 |
||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
ALSO OPRATES AT 3.3 V SUPPLY |
4 mm |
CMOS |
1.8 V |
I2C |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.7 V |
105 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
0 |
48 MHz |
4 mm |
CMOS |
3.3 V |
I2C; SPI; UART; USB |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
3 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
24 mm |
32 |
33.33 MHz |
30 |
260 |
24 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI |
.5 mm |
S-PQFP-G176 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
8 |
FLATPACK, THIN PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
NO |
QUAD |
YES |
1.2 mm |
7 mm |
ADDRESS BUS WIDTH IS 11 AND DATA BUS WIDTH IS 8 IN EXTERNAL MCU MODE |
0 |
6 MHz |
30 |
260 |
7 mm |
CMOS |
3.3 V |
NO |
MROM |
.5 mm |
S-PQFP-G48 |
2 |
Not Qualified |
6 rpm |
e4 |
14 |
|||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BUTT |
100 |
BCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1.21 V |
0 |
1.1,3.3 |
CHIP CARRIER |
SLGA100,15X15,24 |
.99 V |
85 Cel |
625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
.8 mm |
9 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
0 |
50 MHz |
30 |
260 |
9 mm |
CMOS |
1.1 V |
Bus Controllers |
PCI; I2C |
.6 mm |
S-PBCC-B100 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
3 V |
85 Cel |
35 MBps |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7 mm |
24 MHz |
7 mm |
CMOS |
315 mA |
3.3 V |
Bus Controllers |
I2C; SMBUS; SPI; USB |
.5 mm |
S-PQCC-N48 |
Not Qualified |
e3 |
|||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
1,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
.9 V |
85 Cel |
32000 MBps |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.92 mm |
23 mm |
ALSO OPERATES AT 100 MHZ |
0 |
125 MHz |
30 |
245 |
23 mm |
CMOS |
3400 mA |
1 V |
Bus Controllers |
I2C; ISA; VGA |
1 mm |
S-PBGA-B484 |
4 |
Not Qualified |
e1 |
|||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
SMALL OUTLINE |
SOP16,.25 |
2.7 V |
105 Cel |
.125 MBps |
-40 Cel |
DUAL |
1.727 mm |
3.8985 mm |
0 |
48 MHz |
9.893 mm |
CMOS |
3.3 V |
I2C; SPI; UART; USB |
1.27 mm |
R-PDSO-G16 |
3 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
8 mm |
16 |
12 MHz |
40 |
260 |
8 mm |
CMOS |
60 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQCC-N56 |
2 |
Not Qualified |
e4 |
||||||||||||||||||||||
Plx Technology |
BUS CONTROLLER, PCI |
GULL WING |
176 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
FLATPACK |
240 MBps |
TIN LEAD |
QUAD |
32 |
60 MHz |
CMOS |
3.3 V |
Bus Controllers |
PCI |
R-PQFP-G176 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
St-ericsson |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
85 Cel |
2 MBps |
-40 Cel |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 4V-5.5V SUPPLY RANGE. |
8 |
9.7 mm |
CMOS |
3.3 V |
Bus Controllers |
VBUS |
.65 mm |
R-PDSO-G28 |
Not Qualified |
|||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
753 |
SQUARE |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
I2C, SMBUS, UART |
S-PBGA-B753 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.155 V |
0 |
1.1,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100(UNSPEC) |
1.045 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.8 mm |
9 mm |
0 |
50 MHz |
30 |
260 |
9 mm |
CMOS |
1.1 V |
Bus Controllers |
PCI; I2C |
.6 mm |
S-PQCC-N100 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.6 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
4 mm |
ALSO OPERATES AT 3.3 V |
8 |
24 MHz |
4 mm |
CMOS |
34 mA |
1.8 V |
USB, VBUS |
.5 mm |
S-XQCC-N24 |
|||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
4.5 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
3 mm |
3 mm |
CMOS |
1.35 mA |
5 V |
USB |
.5 mm |
S-XQCC-N16 |
e3 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
.9 mm |
3 mm |
3 mm |
CMOS |
1.35 mA |
5 V |
USB |
.5 mm |
S-XQCC-N16 |
e3 |
|||||||||||||||||||||||||||||
|
Exar |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.4 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
5 V |
I2C |
.5 mm |
S-XQCC-N32 |
IEEE 802.3 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.45 V |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3.15 V |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
1 mm |
8 mm |
0 |
24 MHz |
20 |
260 |
8 mm |
CMOS |
3.3 V |
Bus Controllers |
.5 mm |
S-XQCC-N56 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2.5/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
2.3 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
30 |
260 |
5 mm |
CMOS |
3.6 V |
Bus Controllers |
.65 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
3.8 mm |
28 mm |
32 |
66 MHz |
28 mm |
CMOS |
510 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G208 |
3 |
Not Qualified |
e3 |
||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
BGA324,18X18,40 |
1 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.9 mm |
19 mm |
0 |
100 MHz |
19 mm |
CMOS |
I2C, PCI, SMBUS |
1 mm |
S-PBGA-B324 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
Bus Controllers |
VGA |
.8 mm |
S-PBGA-B169 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Exar |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
3 |
||||||||||||||||||||||||||||||||||
|
Exar |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
2.97 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
3 mm |
3 mm |
CMOS |
3.3 V |
Serial IO/Communication Controllers |
I2C |
.5 mm |
S-XQCC-N16 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.7 V |
105 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
0 |
48 MHz |
4 mm |
CMOS |
3.3 V |
I2C; SPI; UART; USB |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||
|
St-ericsson |
INDUSTRIAL |
NO LEAD |
56 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
CHIP CARRIER |
LCC56,.31SQ,20 |
85 Cel |
-40 Cel |
QUAD |
60 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQCC-N56 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
2.3 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.1 mm |
4.4 mm |
8 |
28.5 MHz |
30 |
260 |
6.5 mm |
CMOS |
8 mA |
2.5 V |
Bus Controllers |
I2C |
.65 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
8 |
5 |
SMALL OUTLINE |
SOP20,.4 |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
8 |
12 MHz |
30 |
260 |
12.8 mm |
CMOS |
1.5 mA |
5 V |
Parallel IO Port |
8051; 8049; 8048; 68000; 6800; 8088; Z80 |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C; PCI |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
ALSO HAVING SECONDARY DIGITAL SUPPLY 3.3V(TYP), 24 MHZ CRYSTAL INPUT |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C; SMBUS; VBUS; VGA |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
|||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
CHIP CARRIER |
LCC48,.28SQ,20 |
3 V |
85 Cel |
625 MBps |
-40 Cel |
TIN BISMUTH |
QUAD |
.9 mm |
7 mm |
100 MHz |
7 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI; SPI |
.5 mm |
S-PQCC-N48 |
Not Qualified |
e6 |
||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.7 V |
85 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
0 |
48 MHz |
4 mm |
CMOS |
3.3 V |
I2C, SPI, UART, USB |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA196,14X14,40 |
.95 V |
85 Cel |
.0125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.9 mm |
15 mm |
260 |
15 mm |
CMOS |
1 V |
I2C |
1 mm |
S-PBGA-B196 |
3 |
e1 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
GULL WING |
128 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.05 V |
85 Cel |
312.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
32 |
14 mm |
CMOS |
1.1 V |
I2C; PCI; SMBUS |
.4 mm |
S-PQFP-G128 |
IEEE 1149.1 |
e3 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
2.4 V |
85 Cel |
.05 MBps |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.1 mm |
4.4 mm |
30 |
260 |
5 mm |
CMOS |
15 mA |
UART |
.65 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
2.4/3.6 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.4 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
4 mm |
0 |
18 MHz |
30 |
260 |
4 mm |
CMOS |
16 mA |
Bus Controllers |
.5 mm |
S-PQCC-N24 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
2.4/3.6 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
TSSOP16,.25 |
2.4 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
4 mm |
0 |
18 MHz |
30 |
260 |
4 mm |
CMOS |
16 mA |
Bus Controllers |
.5 mm |
S-PQCC-N24 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
2.4/3.6 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
TSSOP16,.25 |
2.4 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
4 mm |
0 |
18 MHz |
30 |
260 |
4 mm |
CMOS |
16 mA |
Bus Controllers |
.5 mm |
S-PQCC-N24 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
2.4/3.6 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
2.4 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.1 mm |
4.4 mm |
0 |
18 MHz |
30 |
260 |
5 mm |
CMOS |
16 mA |
Bus Controllers |
.65 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
2.4/3.6 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
2.4 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.1 mm |
4.4 mm |
0 |
18 MHz |
30 |
260 |
5 mm |
CMOS |
16 mA |
Bus Controllers |
.65 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e4 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.