Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 1.5 V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI |
.8 mm |
S-PBGA-B169 |
3 |
e1 |
|||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X86; POWERPC; MIPS; ARM; PCI |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.31 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.22 V |
70 Cel |
625 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1 mm |
9 mm |
ALSO OPRATES AT 3.3 V SUPPLY |
25 MHz |
40 |
260 |
9 mm |
CMOS |
1177 mA |
1.25 V |
I2C; SMBUS; SPI; USB |
.5 mm |
S-PQCC-N64 |
1 |
e3 |
|||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
56 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA56,8X8,20 |
3 V |
70 Cel |
60 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
5 mm |
0 |
48 MHz |
40 |
260 |
5 mm |
CMOS |
85 mA |
3.3 V |
I2C; UART; USB |
.5 mm |
S-PBGA-B56 |
3 |
e1 |
||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
3.3/5 |
SMALL OUTLINE |
SOP28,.4 |
3 V |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
8 |
24 MHz |
30 |
260 |
17.9 mm |
CMOS |
40 mA |
5 V |
Bus Controllers |
USB |
1.27 mm |
R-PDSO-G28 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
85 Cel |
250 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 3.3V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
Bus Controllers |
VGA |
.8 mm |
S-PBGA-B169 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V SUPPLY |
0 |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C, SMBUS, SPI, USB |
.4 mm |
S-XQCC-N56 |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, VME |
INDUSTRIAL |
BALL |
313 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
64 |
5 |
GRID ARRAY |
BGA313,25X25,50 |
4.5 V |
85 Cel |
70 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.46 mm |
35 mm |
64 |
33 MHz |
260 |
35 mm |
CMOS |
5 V |
Bus Controllers |
PCI |
2.54 mm |
S-PBGA-B313 |
3 |
Not Qualified |
IEEE 1149.1 |
e1 |
|||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
1.5 MBps |
-40 Cel |
QUAD |
1 mm |
5 mm |
0 |
12 MHz |
5 mm |
CMOS |
15 mA |
3.3 V |
UART, USB |
.65 mm |
S-PQCC-N20 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
also available with 3.3v supply |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N100 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
88 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
70 Cel |
0 Cel |
PURE TIN |
QUAD |
1 mm |
10 mm |
26 MHz |
10 mm |
CMOS |
1.2 V |
I2C |
.4 mm |
S-XQCC-N88 |
3 |
|||||||||||||||||||||||||||||||
|
FTDI |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.97 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 5 V TYP |
12 MHz |
30 |
260 |
5 mm |
CMOS |
80 mA |
3.3 V |
I2C; SPI; VBUS |
.5 mm |
S-XQCC-N32 |
3 |
e3 |
||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; I2S; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
.99 V |
85 Cel |
625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
0 |
30 |
260 |
CMOS |
1.1 V |
I2C; SMBUS |
S-XQCC-N64 |
3 |
e4 |
||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B676 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
2.4 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
18 MHz |
30 |
260 |
5 mm |
CMOS |
6.7 mA |
3 V |
Bus Controllers |
.65 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
TS 16949 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
70 Cel |
35 MBps |
0 Cel |
MATTE TIN |
QUAD |
.9 mm |
6 mm |
24 MHz |
6 mm |
CMOS |
165 mA |
1.8 V |
Bus Controllers |
I2C; SPI; UART; USB |
.5 mm |
S-XQCC-N36 |
Not Qualified |
e3 |
||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
GULL WING |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
SMALL OUTLINE, SHRINK PITCH |
SSOP56,.4 |
3 V |
105 Cel |
60 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.794 mm |
7.5057 mm |
0 |
48 MHz |
30 |
260 |
18.415 mm |
CMOS |
85 mA |
3.3 V |
I2C; UART; USB |
.635 mm |
R-PDSO-G56 |
3 |
e4 |
||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.21 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.09 V |
85 Cel |
1250 MBps |
-40 Cel |
Matte Tin (Sn) |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.15 V |
I2C; I2S; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N100 |
e3 |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
70 Cel |
0 Cel |
PURE TIN |
QUAD |
1 mm |
8 mm |
26 MHz |
8 mm |
CMOS |
1.2 V |
I2C |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||||
|
FTDI |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.97 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 5 V TYP |
12 MHz |
30 |
260 |
5 mm |
CMOS |
80 mA |
3.3 V |
I2C; SPI; VBUS |
.5 mm |
S-XQCC-N32 |
3 |
e3 |
||||||||||||||||||||||||
St-ericsson |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
85 Cel |
2 MBps |
-40 Cel |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 4V-5.5V SUPPLY RANGE. |
8 |
9.7 mm |
CMOS |
3.3 V |
Bus Controllers |
VBUS |
.65 mm |
R-PDSO-G28 |
Not Qualified |
|||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V |
0 |
7 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; USB |
.4 mm |
S-PQCC-N56 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
3 V |
85 Cel |
.0125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
24 MHz |
6 mm |
CMOS |
175 mA |
1.2 V |
I2C; SMBUS; UART; USB |
.5 mm |
S-PQCC-N36 |
e3 |
|||||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
9 mm |
ALSO OPERATES AT 3.3 V |
24 MHz |
9 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART; USB |
.5 mm |
S-PQCC-N64 |
||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
324 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BGA324,18X18,40 |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
19 mm |
245 |
19 mm |
CMOS |
1 mm |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
70 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
PCI |
X-XXSS-X |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
3 V |
85 Cel |
.0125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
24 MHz |
6 mm |
CMOS |
1.2 V |
I2C; SMBUS; USB |
.5 mm |
S-PQCC-N36 |
e3 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
2.4/3.6 |
SMALL OUTLINE |
TSSOP16,.25 |
2.4 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.1 mm |
4.4 mm |
0 |
18 MHz |
30 |
260 |
5 mm |
CMOS |
16 mA |
3 V |
Bus Controllers |
I2C |
.65 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
85 Cel |
625 MBps |
-40 Cel |
QUAD |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V SUPPLY |
0 |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C, SMBUS, SPI, USB |
.4 mm |
S-XQCC-N56 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.4 V |
85 Cel |
.225 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
0 |
30 |
260 |
5 mm |
CMOS |
3 V |
I2C |
.65 mm |
R-PDSO-G16 |
1 |
e4 |
||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
1.2,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.08 V |
85 Cel |
625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
25 MHz |
40 |
260 |
9 mm |
CMOS |
1.2 V |
Bus Controllers |
I2C; SMBUS; SPI; UART; USB |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.155 V |
AEC-Q100 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.045 V |
85 Cel |
375 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.2 mm |
10 mm |
40 MHz |
30 |
260 |
10 mm |
CMOS |
1.1 V |
ATA |
.5 mm |
S-PQFP-G64 |
3 |
IEEE 1149.6; IEEE 1149.1 |
e4 |
|||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
3 V |
85 Cel |
.0125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
24 MHz |
6 mm |
CMOS |
1.2 V |
I2C; SMBUS; UART; USB |
.5 mm |
S-PQCC-N36 |
e3 |
||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
85 Cel |
625 MBps |
-40 Cel |
QUAD |
.9 mm |
12 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; I2S; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
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|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V SUPPLY |
0 |
25 MHz |
7 mm |
CMOS |
1.2 V |
I2C, SMBUS, SPI, USB |
.4 mm |
S-XQCC-N56 |
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|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
70 Cel |
625 MBps |
0 Cel |
QUAD |
.9 mm |
12 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; I2S; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
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|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
.99 V |
85 Cel |
625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY;24 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE |
0 |
30 |
260 |
CMOS |
1.1 V |
I2C; SMBUS |
S-XQCC-N64 |
3 |
e4 |
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|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.99 V |
70 Cel |
625 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
9 mm |
3.3V SUPPLY ALSO AVAILABLE, 34 MHZ NOMINAL CRYSTAL AVAILABLE, |
0 |
30 |
260 |
9 mm |
CMOS |
1.1 V |
I2C |
.5 mm |
S-PQCC-N64 |
3 |
e4 |
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|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
32 |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
e1 |
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FTDI |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.98 V |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.62 V |
85 Cel |
60 MBps |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 |
12 MHz |
8 mm |
CMOS |
1.8 V |
8048; 8051; I2C; SPI; UART; VBUS |
.5 mm |
S-XQCC-N56 |
RS232; RS422; RS485 |
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|
Analog Devices |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
LCC32,.2SQ,20 |
3 V |
85 Cel |
12 MBps |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.2 mm |
5 mm |
0 |
12 MHz |
30 |
260 |
5 mm |
BICMOS |
45 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G32 |
1 |
Not Qualified |
e3 |
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|
NXP Semiconductors |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2.5/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
85 Cel |
-40 Cel |
DUAL |
.1 mA |
Bus Controllers |
.635 mm |
R-PDSO-G8 |
Not Qualified |
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|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
3 V |
70 Cel |
12 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
7 mm |
0 |
12 MHz |
30 |
260 |
7 mm |
CMOS |
15 mA |
3.3 V |
Bus Controllers |
I2C; UART |
.8 mm |
S-PQFP-G32 |
3 |
Not Qualified |
RS232; RS485 |
e4 |
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|
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA169,13X13,32 |
1.35 V |
70 Cel |
250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
12 mm |
ALSO OPERATES AT 1.5 V SUPPLY |
32 |
125 MHz |
30 |
260 |
12 mm |
CMOS |
1.5 V |
PCI |
.8 mm |
S-PBGA-B169 |
3 |
e1 |
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|
FTDI |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
2.97 V |
85 Cel |
.425 MBps |
-40 Cel |
DUAL |
1.7526 mm |
3.9116 mm |
12.02 MHz |
4.9022 mm |
CMOS |
8.65 mA |
5 V |
Bus Controllers |
I2C; UART; USB |
.635 mm |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||||||||||||||
|
Analog Devices |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
85 Cel |
12 MBps |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.8 mm |
5 mm |
0 |
12 MHz |
30 |
260 |
5 mm |
BICMOS |
45 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-XQCC-N32 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
64 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG |
.99 V |
85 Cel |
625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
0 |
30 |
260 |
CMOS |
1.1 V |
I2C; SMBUS |
S-XQCC-N64 |
3 |
e4 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.