256 Digital Signal Processors (DSPs) 169

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6713GFN150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		22			GRID ARRAY		1.14 V					BOTTOM	2.32 mm		27 mm		YES	32	150 MHz			MULTIPLE	27 mm		CMOS	1.2 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified			NO
OMAPL137BZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		13		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	456 MHz	30	260	MULTIPLE	17 mm		CMOS	1.3 V		Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS32C6211BZFN180H	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		20			GRID ARRAY		1.71 V					BOTTOM	2.32 mm		27 mm		YES	32				MULTIPLE	27 mm		CMOS	1.8 V				1.27 mm	FIXED POINT	S-PBGA-B256				NO	NO
TMS320C6711GFN150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.8 V	90 Cel		0 Cel		BOTTOM	2.32 mm	17408	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	149.25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.9 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6747CZKBT3R	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		13			GRID ARRAY, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V				.5 mm	FLOATING POINT	S-PBGA-B256	3			YES	NO	e1
TMS320C6727GDHA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V					BOTTOM	2.02 mm	262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	NO
TMS320C6747BZKB4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		16	32	1.3,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	MULTIPLE	17 mm		CMOS	1.3 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
OMAPL137CZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM								30	260				CMOS			Other Microprocessor ICs		1 mm		S-PBGA-B256	3	Not Qualified				e1
OMAPL137BZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		13		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	375 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V		Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6747CZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		13	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.5 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS32C6711BGFNA100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA272,20X20,50	1.71 V	105 Cel		-40 Cel		BOTTOM	2.32 mm	17408	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.8 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
OMAPL137DZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	15		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3	CMOS	1.2 V	40	Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
TMS320C6727GDH	Texas Instruments			BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	GRID ARRAY	BGA256,16X16,40						BOTTOM		262144											CMOS			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256		Not Qualified
TMS320C6727GDH300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V					BOTTOM	2.02 mm	262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	NO
TMS320C6211BGFNA150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.85 V		16	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.75 V					BOTTOM	2.32 mm	4096	27 mm	-40 TO 105 OPERATING CASE TEMPERATURE	YES	16	150 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.8 V		Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified		YES	NO
OMAPL137CZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40		70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM								30	260				CMOS			Other Microprocessor ICs		1 mm		S-PBGA-B256	3	Not Qualified				e1
OMAPL137ZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256		SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY							BOTTOM													CMOS							S-PBGA-B256		Not Qualified
OMAPL137BZKBA3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		13		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	375 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V		Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6727BZDH250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		13			GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.02 mm		17 mm		YES	32	25 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V				.5 mm	FIXED POINT	S-PBGA-B256	3			NO	NO	e1
TMS320C6727BZDH350	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	32	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.02 mm	262144	17 mm	32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY	YES	32	25 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V	16	Digital Signal Processors	MROM	1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	NO	e1	8
TMS320C6712GFN100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V					BOTTOM	2.32 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.8 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6711BGFNA100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V					BOTTOM	2.32 mm	18432	27 mm		YES	32	100 MHz			MULTIPLE	27 mm		CMOS	1.8 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6711BGFN100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V					BOTTOM	2.32 mm	18432	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.8 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
TMS320C6211BGFN150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY	BGA256,20X20,50	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	2.32 mm	4096	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	150 MHz	20	220	MULTIPLE	27 mm	2	CMOS	1.8 V	16	Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B256	4	Not Qualified		YES	NO	e0
OMAPL137BZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		13		1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm	IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY	YES	16	456 MHz	30	260	MULTIPLE	17 mm		CMOS	1.3 V		Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
TMS320C6743BZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		15	32	1.2,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V				TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm		CMOS	1.2 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
5962R1023101VXC	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	GULL WING	256	GQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1.32 V		13			FLATPACK, GUARD RING		1.14 V	125 Cel		-55 Cel		QUAD	3.21 mm		36 mm		NO	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	36 mm		CMOS	1.2 V				.5 mm	FLOATING POINT	S-CQFP-G256		Not Qualified		YES	NO
OMAPL137DZKBD4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	15		1.3,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.25 V	70 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3	CMOS	1.3 V	40	Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
TMS320C6747BZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		16	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
OMAPL137ZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256		SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY							BOTTOM													CMOS							S-PBGA-B256		Not Qualified
5962R1023102VXC	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	256	GQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1.32 V		13			FLATPACK, GUARD RING		1.14 V	115 Cel		-55 Cel	GOLD	QUAD	3.21 mm		36 mm		NO	32	25 MHz			MULTIPLE	36 mm		CMOS	1.2 V				.5 mm	FLOATING POINT	S-CQFP-G256		Not Qualified		YES	NO	e4
OMAPL137DZKBT3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	15		1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	499712	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	3	CMOS	1.2 V	40	Other Microprocessor ICs		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	NO	e1
TMS320C6713GFN225	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		22			GRID ARRAY		1.14 V					BOTTOM	2.32 mm		27 mm		YES	32	225 MHz			MULTIPLE	27 mm		CMOS	1.2 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified			NO
ADBF561WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	UNSPECIFIED		YES	1.375 V		26			GRID ARRAY		.95 V	85 Cel		-40 Cel		BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	133 MHz			MULTIPLE	17 mm		CMOS	1.25 V				1 mm	FIXED POINT	S-XBGA-B256		Not Qualified		YES	YES
ADSP-21368SKBPZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21367SKBPZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS	1.3 V				.8 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21369KBP-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		0			GRID ARRAY		1.25 V	70 Cel		0 Cel		BOTTOM					NO	0	25 MHz			MULTIPLE			CMOS	1.3 V					FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
ADSP-21369KBPZ-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21367BBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-21368KBP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	40	260	MULTIPLE	27 mm		CMOS	1.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21367KBPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21368KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21368BBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-BF561KBCZ-500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		26	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm		YES	32	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS	1.2 V		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B256		Not Qualified	500 rpm	YES	YES
ADSP-21369KBP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	30	240	MULTIPLE	27 mm		CMOS	1.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21368BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21367KBP-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		0			GRID ARRAY		1.25 V	70 Cel		0 Cel		BOTTOM					NO	0	25 MHz			MULTIPLE			CMOS	1.3 V					FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
ADSP-21368KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel		0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz	40	260	MULTIPLE	27 mm		CMOS	1.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.