256 Digital Signal Processors (DSPs) 169

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code
ADSP-21535PKCA-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA256(UNSPEC)	.86 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	8192	27 mm		YES	32	300 MHz			SINGLE	27 mm	CMOS	1.5 V	Digital Signal Processors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified		YES	YES	e0
ADSP-21368KBP-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V	0			GRID ARRAY		1.25 V	70 Cel	0 Cel		BOTTOM					NO	0	25 MHz			MULTIPLE		CMOS	1.3 V			FLOATING POINT	S-PBGA-B256		Not Qualified		YES	NO
ADSP-21367KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21369BBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-BF561SKBCZ600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	133 MHz			MULTIPLE	12 mm	CMOS	1.25 V	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21369KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-21367SKBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	12 mm	CMOS	1.3 V		.8 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21369KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz	30	260	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-BF561WBBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	26	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	133 MHz			MULTIPLE	17 mm	CMOS	1.25 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	533 rpm	YES	YES	e1
ADSP-21367KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel	0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz	40	260	MULTIPLE	27 mm	CMOS	1.3 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21367KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-BF561SKBCZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	12 mm	CMOS	1.25 V	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-21367KBP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24	32	1.3,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel	0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	30	240	MULTIPLE	27 mm	CMOS	1.3 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21369KBPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel	0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21368SKBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21367KBPZ-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24	32	1.3,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel	0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	40	260	MULTIPLE	27 mm	CMOS	1.3 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21368KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-21367BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES
ADSP-21368KBPZ-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.235 V	70 Cel	0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	40	260	MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-21368KBPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel	0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES
ADSP-BF561SKBCZ-5V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	23	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	533 MHz		260	MULTIPLE	12 mm	CMOS	1.25 V	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF561KBCZ-600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.45 V	26	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel	0 Cel		BOTTOM	1.7 mm		12 mm		YES	32	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm	CMOS	1.2 V	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B256		Not Qualified	600 rpm	YES	YES
ADSP-21367KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm	CMOS	1.2 V	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-21368KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21369KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.