384 Digital Signal Processors (DSPs) 83

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6203GLS17A-300	Texas Instruments			BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32						BOTTOM		98304											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified
TMS320C6203GLS-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGLSA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS	1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGNY30C	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.43 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.35 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	220	MULTIPLE	18 mm	2	CMOS	1.5 V	4	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified	YES	NO	e0	8
TMS320C6203BGNY3E	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.43 V					BOTTOM	2.35 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLS250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V				TIN LEAD	BOTTOM	2.8 mm	98304	18 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	250 MHz			MULTIPLE	18 mm		CMOS	1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO	e0
TMS320C6202GLS-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLSA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLS-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLS-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLS17-250	Texas Instruments			BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32						BOTTOM		98304											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified
TMS320C6203BGLSH	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V					BOTTOM	2.8 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGLS-3H	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.43 V					BOTTOM	2.8 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS	1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLSA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm		CMOS	1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGNY250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8	22	32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.43 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	2.35 mm	32768	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	20	220	MULTIPLE	18 mm	2	CMOS	1.5 V	4	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified	YES	NO	e0	8
TMS320C6203CGNYA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32		90 Cel		0 Cel		BOTTOM		524288											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified
TMS320C6203GLSA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS32C6203BGLS173H	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS	1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLS-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLS-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm		CMOS	1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLSA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGNYA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	BGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY	BGA384,22X22,32	1.43 V	90 Cel		0 Cel		BOTTOM		524288			YES	32	250 MHz			MULTIPLE			CMOS	1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLSA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS302C6203BGLS173H	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED		BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32						BOTTOM		524288											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified
TMS320C6202GLSA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLSA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203BGNY17C	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.65 V				TIN LEAD	BOTTOM	2.35 mm	524288	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	300 MHz	20	220	MULTIPLE	18 mm		CMOS	1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified	YES	NO	e0
TMS320C6202BGLSA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLS-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS	1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202GLSA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.71 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm		CMOS	1.8 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLS17-300	Texas Instruments			BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32						BOTTOM		98304											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified
TMS320C6203BGLS300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.75 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.65 V	90 Cel		0 Cel		BOTTOM	2.8 mm	524288	18 mm		YES	32	300 MHz			MULTIPLE	18 mm		CMOS	1.7 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6202BGLS-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA384,22X22,32	1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm	32768	18 mm		YES	32	250 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	18 mm		CMOS	1.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO
TMS320C6203GLS17A-250	Texas Instruments			BALL	384	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.7,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32						BOTTOM		98304											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified
TMS320C6202BGLS-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel		0 Cel		BOTTOM	2.8 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm		CMOS	1.5 V				.8 mm	FIXED POINT	S-PBGA-B384		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.