400 Digital Signal Processors (DSPs) 125

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF548BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS	1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-21569KBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel	0 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-21569BBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-BF548BBCZ-5AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B400				YES	YES
ADSP-21569BBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-21569KBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel	0 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-21569WCBCZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-21160NCB-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V			32	32	1.8/2,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V			TIN LEAD SILVER	BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz		225	MULTIPLE	27 mm		CMOS	1.9 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		NO	YES	e0
MSC7118VF1200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			0	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.6 mm	262144	17 mm		YES	0	300 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		NO	NO	e0
MSC7118VM1200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			0	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	262144	17 mm		YES	0	300 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		NO	NO
ADSP-21566BBCZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel	0 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-BF547MBBCZ-5M	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS	1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF547BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS	1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-SC572KBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-21593KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES		8
ADSP-21160MKBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.49 mm	131072	27 mm		YES	64	80 MHz		260	MULTIPLE	27 mm		CMOS	2.5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		YES	YES	e1
ADSP-BF547KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.3 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	600 rpm	YES	YES	e1
AD21573WCSWZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.47 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	3.3 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSC573WCBCZ3XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADBF549MWBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADSC572WCBCZ42XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSC573WCBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADBF549WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADSC572WCBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADBF544WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADBF542WBBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.2 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
AD21573WCBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
AD21573WCBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADBF542WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V			22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.188 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADSC573WCBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	105 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-SC573KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF542BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.188 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS	1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-21567WCBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-BF542BBCZ-5X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.9 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS	1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	1	Not Qualified	600 rpm	YES	YES	e3
ADSP-21567WCBCZ8RL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-SC573KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES				16			GRID ARRAY, LOW PROFILE, FINE PITCH			70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS					.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF549BBCZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			26			GRID ARRAY, LOW PROFILE, FINE PITCH		.9 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS	1.25 V				.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADSP-21567KBCZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	110 Cel	0 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-SC572CBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.1 V				.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF547BBCZ-5X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.9 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS	1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	1	Not Qualified	600 rpm	YES	YES	e3
ADSP-21567BBCZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16		30	260	MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400	3			YES	YES
ADSP-21566WCBCZ4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-21567WCBCZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES
ADSP-BF547YBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS	1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-21160NKB-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V			32	32	1.8/2,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz			MULTIPLE	27 mm		CMOS	1.9 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400		Not Qualified		NO	YES	e0
ADSP-21160NKBZ-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2 V			32	32	1.9,3.3	GRID ARRAY	BGA400,20X20,50	1.8 V	85 Cel	0 Cel		BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.9 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400		Not Qualified		NO	YES
ADSP-21160MKB-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			32	32		GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.49 mm	131072	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			MULTIPLE	27 mm		CMOS	2.5 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400		Not Qualified		YES	YES	e0
ADSP21569WCBCZ10RL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	AEC-Q100	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.38 mm	163840	17 mm		YES	16				MULTIPLE	17 mm	10	CMOS	1 V			FLASH	.8 mm	FLOATING POINT	S-PBGA-B400				YES	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.