400 Digital Signal Processors (DSPs) 125

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21594BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC592BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC594BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC592KBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-21594BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC594BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-21593BBPZ10	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	2MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC591KBPZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC591BBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC591BBPZ6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	-40 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
ADSP-SC591KBPZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	0			GRID ARRAY	BGA400,20X20,32	.95 V	125 Cel	0 Cel		BOTTOM	1.75 mm	655360	17 mm	1MB Large on-chip Level 2 (L2) SRAM Available	YES	0	30 MHz			MULTIPLE	17 mm	16	CMOS	1 V	6		FLASH	.8 mm	FLOATING POINT	S-PBGA-B400			YES	YES		8
MSC7119VM1200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.6 mm		17 mm		YES	0	300 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V				.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e1
MSC7119VF800	NXP Semiconductors		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY		YES				16	1.2,2.5,3.3	GRID ARRAY, FINE PITCH	BGA400,20X20,32			-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM		229376											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified			e0
MSC7115VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO
MSC7116VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.6 mm		17 mm		YES	0	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V				.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e1
MSC7112VM800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO
MSC7119VF1200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.6 mm		17 mm		YES	0	300 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V				.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7113VF800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7113VM800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO
MSC7115VF800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7116VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.6 mm		17 mm		YES	0	266 MHz	30	225	MULTIPLE	17 mm		CMOS	1.2 V				.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7112VF800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7113VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7113VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO
MSC7115VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	30	225	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0
MSC7119VM800	NXP Semiconductors		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY		YES				16	1.2,2.5,3.3	GRID ARRAY, FINE PITCH	BGA400,20X20,32			-40 Cel		BOTTOM		229376											CMOS			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified
MSC7112VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO
MSC7115VM800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO
MSC7112VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	YES	NO	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.