431 Digital Signal Processors (DSPs) 22

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
MSC8126VT6400	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM											CMOS		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8122TVT6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm	YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e2
MSC8122MP4800	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM											CMOS		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8122VT8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.24 V	32			GRID ARRAY, FINE PITCH		1.16 V			TIN SILVER	BOTTOM	3.3 mm		20 mm	YES	32	500 MHz	30	250	MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e2
MSC8122TMP6400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.3 mm		20 mm	YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e0
MSC8112TVT2400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32	16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,23X23,32	1.07 V				BOTTOM	3.3 mm	114688	20 mm	YES	64	100 MHz	30	250	MULTIPLE	20 mm	CMOS	1.1 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B431	3	Not Qualified	YES	NO	e2
MSC8122MP4800V	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM											CMOS		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8122TMP4800V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32			GRID ARRAY, FINE PITCH		1.07 V	105 Cel	-40 Cel		BOTTOM	3.3 mm		20 mm	YES	32	300 MHz			MULTIPLE	20 mm	CMOS	1.1 V		.8 mm	FIXED POINT	S-PBGA-B431			YES	NO
MSC8122TMP6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel		BOTTOM	3.3 mm		20 mm	YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO
MSC8126TVT6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	0			GRID ARRAY, FINE PITCH		1.14 V				BOTTOM	3.3 mm		20 mm	YES	0	400 MHz			MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431			NO	NO
MSC8112TMP2400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32	16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,23X23,32	1.07 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.3 mm	114688	20 mm	YES	64	100 MHz	30	250	MULTIPLE	20 mm	CMOS	1.1 V	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B431	3	Not Qualified	YES	NO	e0
MSC8122TVT4800V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.13 V	32			GRID ARRAY, FINE PITCH		1.07 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm	YES	32	300 MHz	30	250	MULTIPLE	20 mm	CMOS	1.1 V		.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e2
MSC8122TVT6400V	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32			GRID ARRAY, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.3 mm		20 mm	YES	32	400 MHz	30	250	MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3		YES	NO	e2
MSC8126VT8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.24 V	0			GRID ARRAY, FINE PITCH		1.16 V				BOTTOM	3.3 mm		20 mm	YES	0	500 MHz			MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431			NO	NO
MSC8102M4400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.7 V	32			GRID ARRAY, FINE PITCH		1.55 V				BOTTOM	3.22 mm		20 mm	YES	32	75 MHz			SINGLE	20 mm	CMOS	1.6 V		.8 mm	FIXED POINT	S-CBGA-B431			YES	NO
MSC8102M4000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.7 V	32			GRID ARRAY, FINE PITCH		1.55 V				BOTTOM	3.22 mm		20 mm	YES	32	75 MHz			SINGLE	20 mm	CMOS	1.6 V		.8 mm	FIXED POINT	S-CBGA-B431			YES	NO
MSC8122VT4800	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM											CMOS		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8126MP6400	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.2,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM											CMOS		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8122VT4800V	NXP Semiconductors			BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES			16	1.1,3.3	GRID ARRAY, FINE PITCH	BGA431,21X21,32					BOTTOM											CMOS		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B431		Not Qualified
MSC8122MP8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.24 V	32			GRID ARRAY, FINE PITCH		1.16 V				BOTTOM	3.3 mm		20 mm	YES	32	500 MHz			MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431			YES	NO
MSC8126TMP6400	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	0			GRID ARRAY, FINE PITCH		1.14 V				BOTTOM	3.3 mm		20 mm	YES	0	400 MHz	30	250	MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431	3		NO	NO
MSC8126MP8000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	431	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.24 V	0			GRID ARRAY, FINE PITCH		1.16 V				BOTTOM	3.3 mm		20 mm	YES	0	500 MHz			MULTIPLE	20 mm	CMOS	1.2 V		.8 mm	FIXED POINT	S-PBGA-B431			NO	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.