NXP Semiconductors - MSC8122TMP6400

MSC8122TMP6400 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MSC8122TMP6400
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 431; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MSC8122TMP6400 Datasheet
In Stock164
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.3 mm
Surface Mount: YES
No. of Terminals: 431
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B431
Maximum Clock Frequency: 400 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 20 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 1.26 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Barrel Shifter: NO
Minimum Operating Temperature: -40 Cel
Internal Bus Architecture: MULTIPLE
Length: 20 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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