LFBGA Digital Signal Processors (DSPs) 1,033

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF516KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	30	260	MULTIPLE	12 mm		CMOS		1.4 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF512KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm		CMOS		1.225 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF534BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF522KBCZ-4C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES			30	260	SINGLE	12 mm		CMOS		3.3 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	NO	e1
ADSP-BF548BBCZ-5X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.9 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified	600 rpm	YES	YES	e1
ADSP-21362KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm		YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-BF531WYBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160		Not Qualified	400 rpm	YES	YES	e1
ADSP-21363KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-BF537SKBC1600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	600 rpm	YES	YES	e0
ADSP-21587KBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8	CMOS		1.1 V	1		SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3			YES	NO		8
ADSP-SC572KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V				.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF526KBCZ4C2X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel	0 Cel		BOTTOM	1.4 mm		12 mm		YES		12.288 MHz	NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm		CMOS		3.3 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	400 rpm	YES	NO
ADSP-21365KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-SC572BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V				.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF705BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-21362KBC-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0
ADSP-BF561SKBCZ600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	133 MHz			MULTIPLE	12 mm		CMOS		1.25 V		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21367SKBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	12 mm		CMOS		1.3 V				.8 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21364KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-BF514BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.4 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168		Not Qualified	400 rpm	YES	YES
ADSP-21365KBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21365SKBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSPBF537SKBC1Z600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel	0 Cel		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	600 rpm	YES	YES
ADSP-21366BBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-BF524KBCZ-4C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES				260	SINGLE	12 mm		CMOS		3.3 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	NO	e1
ADSP-21366SBBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-2185MBCA-266	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V		14	16	2.5,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.25 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	1.4 mm	16384	10 mm		NO	24	33 MHz		240	MULTIPLE	10 mm		CMOS		2.5 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-BF536BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF512BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz		260	MULTIPLE	12 mm		CMOS		1.4 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-21364SBBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-BF525KBCZ-5C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel	0 Cel		BOTTOM	1.4 mm		12 mm		YES			NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm		CMOS		3.3 V		Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	533 rpm	YES	NO
ADSP-21362BBC-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0
ADSP-2188MKCA-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.89 V		14	16	2.7,3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.61 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	1.4 mm	57344	10 mm		NO	24	75 MHz			MULTIPLE	10 mm		CMOS		2.75 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-21366KBC-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-21573CBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V				.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF534BBC-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		240	MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	400 rpm	YES	YES	e0
ADSP-2186NKCA-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	1.4 mm	8192	10 mm		NO	24	40 MHz			MULTIPLE	10 mm		CMOS		1.8 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-BF533SKBC750X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	756 rpm	YES	YES	e0
ADSP-BF534WBBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	400 rpm	YES	YES	e1
ADSP-BF537KBC-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel	0 Cel		BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	40 MHz	30	220	MULTIPLE	12 mm		CMOS		1.26 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	600 rpm	YES	YES
ADSP-BF539BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	533 MHz			MULTIPLE	17 mm		CMOS		1.25 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF512KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	30	260	MULTIPLE	12 mm		CMOS		1.4 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSPBF536SBBC2Z400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES
ADSP-2185MKCAZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14			GRID ARRAY, LOW PROFILE, FINE PITCH		2.37 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm		NO	24	37.5 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V				.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-21364KBC-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-BF536BBCZ-3B1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel	-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	300 rpm	YES	YES
ADSP-21587KBCZ-5B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.1 V	70 Cel	0 Cel		BOTTOM	1.5 mm	917504	19 mm		YES	16	500 MHz		260	MULTIPLE	19 mm	8	CMOS		1.15 V	1		SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3			YES	NO		8
ADSP-BF539WBBCZ5F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.37 V		20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.2 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	500 rpm	YES	YES	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.