LFBGA Digital Signal Processors (DSPs) 1,033

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-2187NBCA-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	1.4 mm	32768	10 mm		NO	24	40 MHz		240	MULTIPLE	10 mm		CMOS	1.8 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-SC573CBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	95 Cel	-40 Cel		BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS	1.15 V					.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES
ADSP-21362WBBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel	-40 Cel	MATTE TIN	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified		NO	YES	e3
ADSP-BF525KBCZ-6C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES					SINGLE	12 mm		CMOS	3.3 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	NO	e1
ADSP-BF514BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz			MULTIPLE	12 mm		CMOS	1.225 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF707BBCZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	8	14			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA184,14X14,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	1179648	12 mm		YES	16				MULTIPLE	12 mm	8	CMOS	1.8 V	3	4		FLASH	.8 mm	FIXED POINT	S-PBGA-B184				YES	YES		8
0W888-002-XTP	Onsemi	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		.9 V	85 Cel	-40 Cel		BOTTOM	1.5 mm		7 mm	IT ALSO OPERATES AT NOMINAL 1.25V	NO	0	50 MHz			MULTIPLE	7 mm		CMOS	1.8 V					.8 mm	FIXED POINT	S-PBGA-B64		Not Qualified		YES	YES
MSC7119VM1200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.6 mm		17 mm		YES	0	300 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V					.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e1
MSC7115VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO
MSC7116VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.6 mm		17 mm		YES	0	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V					.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e1
MSC7112VM800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO
MSC7119VF1200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.6 mm		17 mm		YES	0	300 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V					.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7113VF800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7113VM800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO
MSC7115VF800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7116VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.6 mm		17 mm		YES	0	266 MHz	30	225	MULTIPLE	17 mm		CMOS	1.2 V					.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7112VF800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7113VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7113VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO
DSP56852VF120	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.98 V		20			GRID ARRAY, LOW PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel		BOTTOM	1.3 mm		8 mm		YES	16	240 MHz			MULTIPLE	8 mm		CMOS	1.8 V					.8 mm	FIXED POINT	S-PBGA-B81				YES	YES
DSP56852VFE	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.98 V		20			GRID ARRAY, LOW PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel		BOTTOM	1.3 mm		8 mm		YES	16	240 MHz	40	260	MULTIPLE	8 mm		CMOS	1.8 V					.8 mm	FIXED POINT	S-PBGA-B81				YES	YES
MSC7115VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	30	225	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0
MSC7112VM1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO
MSC7115VM800	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	196608	17 mm		YES	32	200 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO
MSC7112VF1000	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	16	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V		-40 Cel	TIN LEAD SILVER	BOTTOM	1.6 mm	196608	17 mm		YES	32	266 MHz	40	260	MULTIPLE	17 mm		CMOS	1.2 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified		YES	NO	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.