COMMERCIAL Digital Signal Processors (DSPs) 1,242

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-21362KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm		YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-2115KP-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	3	TIN LEAD	QUAD	4.45 mm	512	23.875 mm	COMPANDING HARDWARE WITH SERIAL PORTS; INTERNAL WIDTH PMA=14; DMA=14; PMD=24; DMD=16	NO	24	10.24 MHz			MULTIPLE	23.875 mm	1	CMOS	55 mA	5 V	0	2	Digital Signal Processors			1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-21363KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-BF537SKBC1600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors			.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	600 rpm	YES	YES	e0
ADSP-21587KBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel			BOTTOM	1.5 mm	917504	19 mm		YES	16	450 MHz	30	260	MULTIPLE	19 mm	8	CMOS		1.1 V	1				SPI; UART	.8 mm	FLOATING POINT	S-PBGA-B529	3			YES	NO		8
ADSP-SC572KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V						.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-BF526KBCZ4C2X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel			BOTTOM	1.4 mm		12 mm		YES		12.288 MHz	NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm		CMOS		3.3 V			Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	400 rpm	YES	NO
ADSP-21365KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-21367KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS		1.3 V						1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-2171KST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.68X.85,20	4.5 V	70 Cel	1	TIN LEAD	QUAD	1.6 mm	1024	14 mm	8/16 BIT PARALLEL HOST INTERFACE PORT	NO	24	16.67 MHz			MULTIPLE	20 mm	1	CMOS	75 mA	5 V	0	2	Digital Signal Processors	MROM		.5 mm	FIXED POINT	R-PQFP-G128		Not Qualified		YES	YES	e0
ADSP-21362KBC-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0
ADSP-2101KG-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	PIN/PEG	68	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	16	14	16	5	GRID ARRAY	PGA68,11X11	4.5 V	70 Cel	1	TIN LEAD	PERPENDICULAR	4.17 mm	512	27.885 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	20 MHz			MULTIPLE	27.885 mm	1	CMOS	31 mA	5 V	0	2	Digital Signal Processors			2.54 mm	FIXED POINT	S-CPGA-P68		Not Qualified		YES	YES	e0
ADSP-2100AJP	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0	15	16	5	FLATPACK	SPQFP100,.9SQ	4.75 V	70 Cel	4	TIN LEAD	QUAD		0		SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	40.96 MHz			MULTIPLE		0	CMOS	150 mA	5 V	0	0	Digital Signal Processors			.635 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-BF561SKBCZ600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,25	.8 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	133 MHz			MULTIPLE	12 mm		CMOS		1.25 V			Microprocessors			.65 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-2171KST-104	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.68X.85,20	4.5 V	70 Cel	1	TIN LEAD	QUAD	1.6 mm	1024	14 mm	8/16 BIT PARALLEL HOST INTERFACE PORT	NO	24	13 MHz			MULTIPLE	20 mm	1	CMOS	62 mA	5 V	0	2	Digital Signal Processors	MROM		.5 mm	FIXED POINT	R-PQFP-G128		Not Qualified		YES	YES	e0
ADSP-2185LKST-210	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	6	Tin/Lead (Sn/Pb)	QUAD	1.6 mm	8192	14 mm		NO	24				MULTIPLE	14 mm		CMOS		3.3 V				FLASH		.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0	24
ADSP-21364KSQZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-21369KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS		1.2 V			Digital Signal Processors			1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e0
ADSP-21266SKSTZ-1D	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		MATTE TIN	QUAD	1.6 mm	65536	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	50 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21367SKBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	12 mm		CMOS		1.3 V						.8 mm	FLOATING POINT	S-PBGA-B256		Not Qualified		NO	YES	e0
ADSP-21MSP55AKS-52	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK	QFP100,.7X.9	4.5 V	70 Cel	3	TIN LEAD	QUAD		512		16-BIT SIGMA-DELTA ADC AND DAC; 8 BIT PARALLEL HOST INTERFACE PORT; SINGLE CYCLE INSTR EXECUTION	NO	24	13 MHz			MULTIPLE		1	CMOS	90 mA	5 V	0	2	Digital Signal Processors			.635 mm	FIXED POINT	R-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2115KP-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	1	TIN LEAD	QUAD	4.45 mm	512	24.18 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	20 MHz			MULTIPLE	24.18 mm	1	CMOS	31 mA	5 V	0	2	Digital Signal Processors			1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-21364KBCZ-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS	500 mA	1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e1
ADSP-21365KBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-21478KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8	24	40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel		Matte Tin (Sn) - annealed	QUAD	.9 mm	3145728	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH		.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3	8
ADSP-21266SKBC-200X	Analog Devices		COMMERCIAL	BALL	136	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA136,14X14,32		70 Cel			BOTTOM		65536											CMOS	500 mA				Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified
ADSP-21365SKBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V						.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-21479KBCZ-3AX	Analog Devices		COMMERCIAL	BALL	196	FBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.3,3.3	GRID ARRAY, FINE PITCH	BGA196,14X14,32		70 Cel			BOTTOM		163840																Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified
ADSP-2187LKSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	6	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	24			260	MULTIPLE	14 mm		CMOS		3.3 V				FLASH		.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
ADSP-2186KSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		14			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	70 Cel		MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	20 MHz		260	MULTIPLE	14 mm		CMOS		5 V						.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSPBF537SKBC1Z600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	70 Cel			BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors			.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	600 rpm	YES	YES
ADSP-21367KSWZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.3,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.235 V	70 Cel		MATTE TIN	QUAD	1.6 mm	65536	28 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	61.012 MHz			MULTIPLE	28 mm		CMOS		1.3 V			Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-G208		Not Qualified		NO	YES	e3
ADSP-2100KP	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0	15	16	5	FLATPACK	SPQFP100,.9SQ	4.75 V	70 Cel	4	TIN LEAD	QUAD		0		SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	32.768 MHz			MULTIPLE		0	CMOS	90 mA	5 V	0	0	Digital Signal Processors			.635 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-BF524KBCZ-4C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES				260	SINGLE	12 mm		CMOS		3.3 V			Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	NO	e1
ADSP-21366SBBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V						.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-21363SKSQZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.14 V	70 Cel		MATTE TIN	QUAD	1.6 mm		20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1.2 V						.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-BF516KSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel			QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm		CMOS		1.225 V			Microprocessors			.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES
ADSP-21MSP55AK	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14			FLATPACK		4.5 V	70 Cel	3	TIN LEAD	QUAD		512		16-BIT SIGMA-DELTA ADC AND DAC; 8/16 - BIT PARALLEL HOST INTERFACE PORT	NO	24	13 MHz			MULTIPLE		1	CMOS	90 mA	5 V	0	2					FIXED POINT	R-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-21010KS-50	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	FLAT	304	GQFF	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	24	32	5	FLATPACK, GUARD RING	TPAK304,2.2SQ,25	4.5 V	70 Cel	4	TIN LEAD	QUAD	3.85 mm	0	40 mm	37.5 MFLOPS PEAK, 25 MFLOPS SUSTAINED; 12.5 MIPS	YES	48	12.5 MHz			MULTIPLE	40 mm	1	CMOS	390 mA	5 V	0	0	Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-F304		Not Qualified		YES	YES	e0
ADSP-21266SKSTZ-2C	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		Matte Tin (Sn) - annealed	QUAD	1.6 mm	65536	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	66.67 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP2100TG	Analog Devices		COMMERCIAL	PIN/PEG	100	PGA	SQUARE	CERAMIC		NO				16	5	GRID ARRAY	PGA100M,13X13		70 Cel		Tin/Lead (Sn/Pb)	PERPENDICULAR		0											CMOS	100 mA	5 V			Digital Signal Processors			2.54 mm	FIXED POINT	S-XPGA-P100		Not Qualified				e0
ADSP-BF525KBCZ-5C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel			BOTTOM	1.4 mm		12 mm		YES			NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm		CMOS		3.3 V			Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	533 rpm	YES	NO
ADSP-2188MKCA-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.89 V		14	16	2.7,3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.61 V	70 Cel		TIN LEAD SILVER	BOTTOM	1.4 mm	57344	10 mm		NO	24	75 MHz			MULTIPLE	10 mm		CMOS		2.75 V			Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-21366KBC-1AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		TIN LEAD	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors			.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-2115KS-66	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK	QFP80,.7SQ	4.5 V	70 Cel	1	TIN LEAD	QUAD	2.45 mm	512	14 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	16.67 MHz			MULTIPLE	14 mm	1	CMOS	48 mA	5 V	0	2	Digital Signal Processors			.65 mm	FIXED POINT	S-PQFP-G80		Not Qualified		YES	YES	e0
ADSP-BF514KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	70 Cel			QUAD	1.6 mm		24 mm		YES	16	400 MHz	30	260	MULTIPLE	24 mm		CMOS		1.4 V			Microprocessors			.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	400 rpm	YES	YES
ADSP-2186NKCA-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.71 V	70 Cel		TIN LEAD SILVER	BOTTOM	1.4 mm	8192	10 mm		NO	24	40 MHz			MULTIPLE	10 mm		CMOS		1.8 V			Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e0
ADSP-BF533SKBC750X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	70 Cel		TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors			.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	756 rpm	YES	YES	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.