Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Maximum Seated Height | Width | Additional Features | Boundary Scan | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Technology | Maximum Supply Current | Nominal Supply Voltage | Memory Organization | No. of Banks | Sub-Category | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Low Power Mode | JESD-609 Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
PIN/PEG |
132 |
PGA |
SQUARE |
CERAMIC |
NO |
5 |
GRID ARRAY |
PGA132,14X14 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
300 mA |
5 V |
Memory Controllers |
2.54 mm |
S-XPGA-P132 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Intel |
BALL |
732 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,2.5,3.3 |
GRID ARRAY |
BGA732,29X29,50 |
BOTTOM |
CMOS |
Memory Controllers |
1.27 mm |
S-PBGA-B732 |
Not Qualified |
||||||||||||||||||||||||||||
|
Intel |
BALL |
732 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,1.5,3.3 |
GRID ARRAY |
BGA732,29X29,50 |
BOTTOM |
CMOS |
Memory Controllers |
1.27 mm |
S-PBGA-B732 |
Not Qualified |
|||||||||||||||||||||||||||
|
Intel |
MEMORY CONTROLLER, DRAM |
BALL |
1329 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05,1.5,1.8,3.3 |
GRID ARRAY |
BGA1329,48X48,28 |
BOTTOM |
NO |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Memory Controllers |
PCI; USB; ATA |
.7 mm |
S-PBGA-B |
Not Qualified |
NO |
|||||||||||||||||||||
Intel |
MEMORY CONTROLLER, DRAM |
BALL |
998 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
14 |
GRID ARRAY, FINE PITCH |
1 V |
BOTTOM |
1.755 mm |
27 mm |
0.8128 MM PITCH |
NO |
64 |
27 mm |
CMOS |
1.05 V |
64M X 16 |
8 |
USB; PCI; I2C; LPC |
.8 mm |
S-PBGA-B998 |
YES |
|||||||||||||||||
Intel |
OTHER |
PIN/PEG |
240 |
PGA |
SQUARE |
CERAMIC |
NO |
5 |
GRID ARRAY |
PGA240,19X19 |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
600 mA |
5 V |
Memory Controllers |
2.54 mm |
S-XPGA-P240 |
Not Qualified |
e0 |
||||||||||||||||||||||
Intel |
MEMORY CONTROLLER, DRAM |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5/3.3,3.3 |
GRID ARRAY |
BGA324,20X20,50 |
BOTTOM |
2.3 mm |
27 mm |
NO |
64 |
66 MHz |
27 mm |
MOS |
5 V |
256M X 8 |
6 |
Other Microprocessor ICs |
PENTIUM; PCI |
1.27 mm |
S-PBGA-B324 |
1 |
Not Qualified |
NO |
||||||||||||||
|
Intel |
MEMORY CONTROLLER, DRAM |
BALL |
1299 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1025 V |
15 |
GRID ARRAY |
.9975 V |
BOTTOM |
1.73 mm |
35 mm |
NO |
64 |
35 mm |
CMOS |
1.05 V |
256M X 64 |
8 |
ATA, I2C, ISA, LPC, PCI, SIO, SMBUS, SPI, USB |
S-PBGA-B1299 |
YES |
||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
22 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
29.3116 mm |
NO |
0 |
25 MHz |
29.3116 mm |
CMOS |
95 mA |
5 V |
4M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
24.2316 mm |
NO |
0 |
25 MHz |
24.2316 mm |
CMOS |
95 mA |
5 V |
1M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
18 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
24.2316 mm |
CMOS |
5 V |
4 |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
18 |
5 |
CHIP CARRIER |
LCC68,.95SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
2.03 mm |
24.13 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.13 mm |
CMOS |
15 mA |
5 V |
4 |
Memory Controllers |
1.27 mm |
S-CQCC-N68 |
Not Qualified |
NO |
||||||||||
Texas Instruments |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
38535Q/M;38534H;883B |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
TTL |
200 mA |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
18 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
TTL |
200 mA |
5 V |
1M X 16 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
|||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
16.5862 mm |
CMOS |
140 mA |
5 V |
2 |
Memory Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
22 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
29.3116 mm |
NO |
0 |
20 MHz |
29.3116 mm |
CMOS |
75 mA |
5 V |
4M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
24.2316 mm |
NO |
0 |
20 MHz |
24.2316 mm |
CMOS |
75 mA |
5 V |
256K X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
16.5862 mm |
CMOS |
140 mA |
5 V |
2 |
Memory Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
24.2316 mm |
NO |
0 |
33.33 MHz |
24.2316 mm |
CMOS |
150 mA |
5 V |
1M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
CHIP CARRIER |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NO |
0 |
16.5862 mm |
CMOS |
2 |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
|||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
BIPOLAR |
220 mA |
5 V |
1M X 16 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
|||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
24.2316 mm |
NO |
0 |
33.33 MHz |
24.2316 mm |
CMOS |
150 mA |
5 V |
256K X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
24.2316 mm |
NO |
0 |
20 MHz |
24.2316 mm |
CMOS |
75 mA |
5 V |
1M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
CMOS |
50 mA |
5 V |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
BIPOLAR |
220 mA |
5 V |
1M X 16 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
|||||||||
Texas Instruments |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
QUAD |
MOS |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
|||||||||||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
GULL WING |
132 |
GQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
29 |
5 |
FLATPACK, GUARD RING |
SPQFP132,1.1SQ |
4.5 V |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.45 mm |
24.13 mm |
NO |
0 |
24.13 mm |
CMOS |
100 mA |
5 V |
16M X 1 |
4 |
Memory Controllers |
I960CA; I960CF |
.8 mm |
S-PQFP-G132 |
Not Qualified |
NO |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
22 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
29.3116 mm |
NO |
0 |
33.33 MHz |
29.3116 mm |
CMOS |
150 mA |
5 V |
4M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
18 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
CMOS |
15 mA |
5 V |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
||||||||||
Texas Instruments |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
CMOS |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
22 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
29.3116 mm |
NO |
0 |
25 MHz |
29.3116 mm |
CMOS |
90 mA |
5 V |
4M X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
38535Q/M;38534H;883B |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
TTL |
200 mA |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
20 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.08 mm |
24.2316 mm |
NO |
0 |
25 MHz |
24.2316 mm |
CMOS |
95 mA |
5 V |
256K X 1 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
e0 |
||||||||
Texas Instruments |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
QUAD |
MOS |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
|||||||||||||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
16.5862 mm |
CMOS |
140 mA |
5 V |
2 |
Memory Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
18 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
2.03 mm |
24.13 mm |
NO |
0 |
24.13 mm |
CMOS |
5 V |
4 |
1.27 mm |
S-CQCC-N68 |
Not Qualified |
NO |
||||||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
20 |
5 |
CHIP CARRIER |
LCC68(UNSPEC) |
70 Cel |
0 Cel |
QUAD |
2.03 mm |
24.13 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.13 mm |
CMOS |
50 mA |
5 V |
4 |
Memory Controllers |
1.27 mm |
S-CQCC-N68 |
Not Qualified |
NO |
||||||||||||
Texas Instruments |
MEMORY CONTROLLER, DRAM |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
18 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2316 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
24.2316 mm |
TTL |
200 mA |
5 V |
1M X 16 |
4 |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
NO |
|||||||||
Texas Instruments |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC |
YES |
5 |
CHIP CARRIER |
LCC68,.95SQ |
70 Cel |
0 Cel |
QUAD |
CMOS |
15 mA |
5 V |
Memory Controllers |
1.27 mm |
S-XQCC-N68 |
Not Qualified |
|||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
e0 |
||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
75 mA |
5 V |
Memory Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
e0 |
|||||||||||||||||||||
Toshiba |
MEMORY CONTROLLER, CACHE |
GULL WING |
16 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
4.45 mm |
28 mm |
NO |
0 |
28 mm |
CMOS |
3.3 V |
.65 mm |
S-PQFP-G16 |
Not Qualified |
NO |
|||||||||||||||||||||||
Toshiba |
COMMERCIAL |
BALL |
64 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY, FINE PITCH |
BGA64,8X8,32 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
3.3 V |
Memory Controllers |
.8 mm |
S-PBGA-B64 |
Not Qualified |
e0 |
||||||||||||||||||||||
Toshiba |
MEMORY CONTROLLER, CACHE |
GULL WING |
16 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
4.45 mm |
28 mm |
NO |
0 |
28 mm |
CMOS |
3.3 V |
.65 mm |
S-PQFP-G16 |
Not Qualified |
NO |
|||||||||||||||||||||||
Toshiba |
COMMERCIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP128,.64SQ,16 |
70 Cel |
0 Cel |
QUAD |
CMOS |
75 mA |
3.3 V |
Memory Controllers |
.4 mm |
S-PQFP-G128 |
Not Qualified |
|||||||||||||||||||||||
Renesas Electronics |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,1.5,2.5/3.3 |
GRID ARRAY |
BGA484,22X22,40 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Memory Controllers |
1 mm |
S-PBGA-B484 |
Not Qualified |
|||||||||||||||||||||||||
Renesas Electronics |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
FLATPACK |
QFP240,1.3SQ,20 |
Tin/Lead (Sn/Pb) |
QUAD |
3.3 V |
Memory Controllers |
.5 mm |
S-PQFP-G240 |
Not Qualified |
e0 |
Memory controllers are specialized electronic circuits that manage the flow of data between a CPU and memory modules. These circuits are typically found on motherboards or embedded systems and are responsible for controlling the timing and data transfer rates between the CPU and memory modules.
Memory controllers are designed to work with specific types of memory modules, such as dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), or double data rate (DDR) memory. They are responsible for configuring the memory modules and managing the transfer of data between the CPU and memory.
Memory controllers use a variety of techniques to optimize the performance of memory access, including prefetching, pipelining, and cache management. Prefetching involves retrieving data from memory before it is requested by the CPU, while pipelining involves overlapping memory operations to reduce the latency of memory access. Cache management involves using on-chip cache memory to store frequently accessed data, reducing the need to access main memory.
Memory controllers are essential components of modern computer systems, as they play a critical role in determining the overall performance of the system. They are responsible for managing the flow of data between the CPU and memory modules, optimizing memory access, and ensuring the reliability and stability of the system.