Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
24 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.7 V |
85 Cel |
COLDFIRE |
7 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.6 mm |
524288 |
17 mm |
18 INPUT ADC CHANNELS CAN BE SUPPORTED IN MULTIPLEXED MODE |
YES |
DMA(4), LVD, POR, PWM, TIMER(10), WDT |
32 |
66.66 MHz |
40 |
260 |
17 mm |
10 |
65536 |
CMOS |
8-Ch 10-Bit |
200 mA |
3.3 V |
4 |
YES |
7 |
ETHERNET, FLEXCAN, I2C, QSPI, UART(3) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
66.66 rpm |
YES |
e1 |
8 |
142 |
|||||||||||||
|
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
524288 |
40 |
260 |
65536 |
CMOS |
200 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
2.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.6 mm |
17 mm |
32 |
80 MHz |
40 |
260 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
80 rpm |
e1 |
142 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
60 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
210 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
150 rpm |
e1 |
128 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1048576 |
17 mm |
0 |
COMPARATOR(4), DMA(32), POR, RTC, TIMER(23) |
0 |
60 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
4-Ch 16-Bit |
2.5 V |
YES |
CAN(2), ETHERNET, I2C(2), I2S(2), SPI(3), UART(6) |
FLASH |
1 mm |
3 |
150 rpm |
e1 |
8 |
128 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
1048576 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
24 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.4 V |
85 Cel |
CORTEX-M4 |
1 |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 10-Bit |
1.55 mm |
1048576 |
17 mm |
16384 |
YES |
BOD, DMA(8), EMC,LCD, POR, RTC, TIMER(7), WDT |
32 |
25 MHz |
260 |
17 mm |
5 |
139264 |
CMOS |
8-Ch 10-Bit (2) |
100 mA |
3.3 V |
8 |
YES |
5 |
CAN(2), ETHERNET, I2C(2), I2S(2), SPI, SPIFI, SSP(2), UART, USART(3), USB(2) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B256 |
3 |
204 rpm |
YES |
8 |
164 |
|||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
1048576 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
524288 |
40 |
260 |
65536 |
CMOS |
240 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
80 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
1048576 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 10-Bit |
1.55 mm |
1048576 |
17 mm |
16384 |
BOD, DMA(8), EMC, LCD, POR, PWM, TIMER(6), QEI, RTC, WDT |
32 |
25 MHz |
260 |
17 mm |
139264 |
CMOS |
8-Ch 10-Bit (2) |
3.3 V |
YES |
CAN(2), ETHERNET, I2C(2), I2S(2), SDMMC, SPI, SPIFI, SSP(2), UART, USART(3), USB(2) |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
204 rpm |
8 |
164 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.7 mm |
1048576 |
17 mm |
ALSO OPERATES AT 1 V MINIMUM SUPPLY |
0 |
32 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
177 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
120 rpm |
e1 |
132 |
||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
1.71 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.7 mm |
17 mm |
0 |
32 MHz |
40 |
260 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
120 rpm |
e1 |
128 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
1048576 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
270336 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
17 mm |
0 |
25 MHz |
30 |
260 |
17 mm |
288768 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
1048576 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
26 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,17X17,32 |
1.65 V |
85 Cel |
ARM7 |
-40 Cel |
TIN SILVER COPPER |
NO |
BOTTOM |
YES |
1.25 mm |
131072 |
15 mm |
32 |
80 MHz |
15 mm |
16384 |
CMOS |
24.5 mA |
1.8 V |
YES |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B256 |
3 |
Not Qualified |
209 rpm |
e1 |
122 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
NO |
GRID ARRAY, LOW PROFILE |
2.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.6 mm |
17 mm |
32 |
66.67 MHz |
40 |
260 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66.67 rpm |
e1 |
142 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
180 rpm |
e1 |
164 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
524288 |
17 mm |
0 |
60 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
210 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
150 rpm |
e1 |
128 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
524288 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 10-Bit |
1048576 |
17 mm |
16K |
BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT |
0 |
25 MHz |
260 |
17 mm |
139264 |
8-Ch 10-Bit (2) |
3.3 V |
YES |
CAN(2), ETHERNET, I2C(2), I2S(2), SDMMC, SPI, SPIFI, SSP(2), UART, USART(3), USB(2) |
FLASH |
1 mm |
3 |
204 rpm |
8 |
164 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
65536 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
204800 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
Texas Instruments |
MICROCONTROLLER |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
20 |
NO |
32 |
GRID ARRAY |
1.14 V |
105 Cel |
C28X |
-40 Cel |
TIN SILVER COPPER |
NO |
BOTTOM |
YES |
2.1 mm |
0 |
17 mm |
0 |
DMA(6), PWM(18), TIMER(18), WDT |
32 |
30 MHz |
30 |
260 |
17 mm |
528384 |
CMOS |
1.2 V |
6 |
YES |
CAN(2), I2C, SCI(3), SPI(4) |
1 mm |
S-PBGA-B256 |
3 |
300 rpm |
e1 |
0 |
88 |
||||||||||||||||||||||||||
|
Texas Instruments |
MICROCONTROLLER |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.26 V |
16 |
16 |
NO |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
105 Cel |
TMS320 |
8 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2.1 mm |
8192 |
516 |
17 mm |
0 |
IT ALSO OPERATES AT 3.3V |
YES |
"DMA(6), PWM(18), TIMER(18), WDT" |
32 |
300 MHz |
30 |
260 |
17 mm |
18 |
528384 |
CMOS |
1.2 V |
6 |
YES |
2 |
Microcontrollers |
"CAN(2), I2C, SCI(3), SPI(4)" |
MROM |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
300 rpm |
YES |
e1 |
16 |
88 |
|||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
85 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 10-Bit |
1.55 mm |
1048576 |
17 mm |
16K |
BOD, DMA(8), EMC, POR, PWM, TIMER(6), QEI, RTC, WDT |
0 |
25 MHz |
260 |
17 mm |
139264 |
CMOS |
8-Ch 10-Bit (2) |
3.3 V |
YES |
CAN(2), ETHERNET, I2C(2), I2S(2), SDMMC, SPI, SPIFI, SSP(2), UART, USART(3), USB(2) |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
204 rpm |
8 |
164 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
2.7 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
YES |
BOTTOM |
YES |
1.6 mm |
17 mm |
32 |
66 MHz |
30 |
220 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e0 |
8 |
142 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.7 mm |
524288 |
17 mm |
ALSO OPERATES AT 1 V MINIMUM SUPPLY |
0 |
32 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
177 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
120 rpm |
e1 |
132 |
||||||||||||||||||||||||
|
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
524288 |
40 |
260 |
65536 |
CMOS |
200 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
NO |
32 |
GRID ARRAY, LOW PROFILE |
2.7 V |
85 Cel |
-40 Cel |
TIN LEAD SILVER |
YES |
BOTTOM |
YES |
1.6 mm |
17 mm |
32 |
80 MHz |
30 |
220 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
80 rpm |
e0 |
142 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 10-Bit |
1.55 mm |
1048576 |
17 mm |
16384 |
BOD, DMA(8), EMC, LCD, POR, PWM, TIMER(6), QEI, RTC, WDT |
32 |
25 MHz |
17 mm |
139264 |
CMOS |
8-Ch 10-Bit (2) |
3.3 V |
YES |
CAN(2), ETHERNET, I2C(2), I2S(2), SDMMC, SPI, SPIFI, SSP(2), UART, USART(3), USB(2) |
FLASH |
1 mm |
S-PBGA-B256 |
4 |
204 rpm |
8 |
164 |
||||||||||||||||||||||||||||
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
524288 |
30 |
220 |
65536 |
CMOS |
200 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.7 mm |
1048576 |
17 mm |
ALSO OPERATES AT 1 V MINIMUM SUPPLY |
0 |
32 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
177 mA |
3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
120 rpm |
e1 |
132 |
||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
524288 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
524288 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.55 mm |
17 mm |
0 |
25 MHz |
260 |
17 mm |
CMOS |
3.3 V |
YES |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
204 rpm |
164 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
524288 |
17 mm |
0 |
60 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
210 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
150 rpm |
e1 |
128 |
||||||||||||||||||||||||||
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
524288 |
30 |
220 |
65536 |
CMOS |
240 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
80 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
270336 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
65536 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
204800 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
256 |
LBGA |
SQUARE |
YES |
3.6 V |
16 |
YES |
32 |
GRID ARRAY, LOW PROFILE |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1-Ch 10-Bit |
n/s |
17 mm |
0 |
BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT |
16 |
25 MHz |
30 |
260 |
17 mm |
2700336 |
8-Ch 10-Bit (2) |
3.3 V |
YES |
CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4) |
FLASH |
1 mm |
3 |
204 rpm |
e1 |
164 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
60 MHz |
40 |
260 |
17 mm |
131072 |
CMOS |
210 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
150 rpm |
e1 |
128 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
32 |
2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e8 |
164 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
2.2 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.55 mm |
524288 |
17 mm |
32 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
||||||||||||||||||||||||||
|
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
40 |
260 |
65536 |
CMOS |
200 mA |
Microcontrollers |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROCONTROLLER, RISC |
GULL WING |
256 |
LFQFP |
SQUARE |
YES |
1.26 V |
26 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.1 V |
YES |
QUAD |
YES |
28 mm |
32 |
48 MHz |
28 mm |
1.18 V |
YES |
.4 mm |
3 |
400 rpm |
137 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
32 |
2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.2 V |
105 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.