33 Microcontrollers 167

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Digital To Analog Convertors	Maximum Seated Height	ROM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
LPC824M201JHI33Y	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel			-40 Cel		YES	QUAD	YES		.85 mm	32768	5 mm	0	SEATED HGT-NOM		BOD, COMPARATOR, CRC, DMA(18), MRT(4), PMU, POR, PWM, WDT	25 MHz		260	5 mm		8192	CMOS	12-Ch 12-Bit		3.3 V	YES			I2C(4), SPI(2), USART(3)	FLASH	.5 mm		S-PQCC-N33	3		30 rpm			8	29
LPC1114JHN33/203E	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	105 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			32768	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI(2), UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC824M201JHI33Y,518	NXP Semiconductors	MICROCONTROLLER, RISC		NO LEAD	33	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, VERY THIN PROFILE		1.8 V						YES	QUAD	YES		.85 mm		5 mm		SEATED HGT-NOM			25 MHz			5 mm			CMOS			3.3 V	YES				FLASH	.5 mm		S-PQCC-N33			30 rpm				29
LPC824M201JHI33E	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel			-40 Cel		YES	QUAD	YES		.85 mm	32768	5 mm	0	SEATED HGT-NOM		BOD, COMPARATOR, CRC, DMA(18), MRT(4), PMU, POR, PWM, WDT	25 MHz		260	5 mm		8192	CMOS	12-Ch 12-Bit		3.3 V	YES			I2C(4), SPI(2), USART(3)	FLASH	.5 mm		S-PQCC-N33	3		30 rpm			8	29
LPC1112FHI33/202,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			16384	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		2048	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1114FHN33/302,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO			32768	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm		e4	8	28
LPC824M201JHI33	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel			-40 Cel		YES	QUAD	YES		.85 mm		5 mm					25 MHz			5 mm			CMOS			3.3 V	YES				FLASH	.5 mm		S-PQCC-N33			30 rpm				29
LPC1114FHN33/302K	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC33,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO		1 mm	32768	7 mm	0		NO	BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm	5	8192	CMOS	8-Ch 10-Bit		3.3 V	NO	1		I2C, SPI, UART	FLASH	.65 mm	FIXED POINT	S-PQCC-N33	3		50 rpm	YES		8	28
LPC1313FHN33,551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	2 V	85 Cel	ARM7		-40 Cel	MATTE TIN	YES	QUAD	NO		1 mm	32768	7 mm	0			BOD, POR, TIMER(5), WDT(2)	25 MHz	30	260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, MICROWIRE, RS485, SPI, SSI, SSP, UART	FLASH	.65 mm		S-PQCC-N33	3	Not Qualified	72 rpm		e3	8	28
LPC1112FHN33/203,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			16384	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI(2), UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1317FHN33,551	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	2 V	85 Cel	CORTEX-M3		-40 Cel		YES	QUAD	NO		1 mm	65536	7 mm					25 MHz	30	260	7 mm		8192	CMOS			3.3 V	NO		Microcontrollers		FLASH	.65 mm		S-PQCC-N33	3	Not Qualified	72 rpm				26
LPC1114FHN33/302	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1 mm	32768	7 mm	0			BOD, POR, TIMER(4), WDT	25 MHz	30	260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO			I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N33	3		50 rpm		e4	8	28
LPC1114FHN33/303,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			32768	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI(2), UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1114FHN33/301,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1 mm	32768	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz			7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO			I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N33	3		50 rpm		e4	8	28
LPC1114FHN33/301:5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1 mm	32768	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N33	3	Not Qualified	50 rpm		e4	8	28
LPC11U24FHN33/401	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1 mm	32768	7 mm	4096			BOD, COMPARATOR, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SSP(2), USB	FLASH	.65 mm		S-PQCC-N33	3	Not Qualified	50 rpm		e4	8	26
LPC1111FHN33/102,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			8192	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		2048	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1111FHN33/202,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			8192	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1113FHN33/202,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			24576	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1114FHN33/301K	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC33,.2SQ,20	1.8 V	105 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO		1 mm		7 mm			NO		25 MHz		260	7 mm		8192	CMOS			3.3 V	NO				FLASH	.65 mm	FIXED POINT	S-PQCC-N33	3		50 rpm	YES		8	28
LPC1114FHN33/202,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO			32768	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm		e4	8	28
LPC1114FHN33/333,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO			57344	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI(2), UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm		e4	8	28
LPC1313FHN33/01,55	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	2 V	85 Cel	CORTEX-M3		-40 Cel	MATTE TIN	YES	QUAD	NO		1 mm	32768	7 mm	0			BOD, POR, TIMER(5), WDT(2)	25 MHz		260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, MICROWIRE, RS485, SPI, SSI, SSP, UART	FLASH	.65 mm		S-PQCC-N33	3	Not Qualified	72 rpm		e3	8	28
LPC1112FHN33/101,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO			16384	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		2048	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm		e4	8	28
LPC11U35FHI33/501	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	YES		.85 mm	65536	5 mm					25 MHz		260	5 mm		12288	CMOS			3.3 V	NO		Microcontrollers		FLASH	.5 mm		S-PQCC-N33	3	Not Qualified	50 rpm			8	26
LPC1111FHN33/101,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO			8192	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz		260	7 mm		2048	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1111FHN33/102K	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC33,.27SQ,25	1.8 V	85 Cel	CORTEX-M0	0	-40 Cel		YES	QUAD	NO		1 mm	8192	7 mm	0		NO	BOR, POR, TIMER(5), WDT(2)	25 MHz		260	7 mm	5	2048	CMOS	8-Ch 10-Bit	100 mA	3.3 V	NO			I2C, SPI, UART	FLASH	.65 mm	FIXED POINT	S-PQCC-N33	3		50 rpm	YES		8	28
LPC11A13FHI33/201	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		YES	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	2.6 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO	1-Ch 10-Bit	.85 mm	24576	5 mm	2048	SEATED HGT-NOM		BOR, COMPARATOR, POR, TIMER(4), WDT	25 MHz		260	5 mm		6144	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SSP(2), USART	FLASH	.5 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC11A14FHN33/301	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		YES	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	2.6 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	NO	1-Ch 10-Bit	1 mm	32768	7 mm	4096			BOR, COMPARATOR, POR, TIMER(4), WDT	25 MHz		260	7 mm		8192	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SSP(2), USART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm			8	28
LPC1111FHN33/201,5	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO			8192	7 mm	0			BOD, POR, TIMER(5), WDT	25 MHz	30	260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO		Microcontrollers	I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N32	3	Not Qualified	50 rpm		e4	8	28
LPC1112FHN33/202	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M0		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1 mm	16384	7 mm	0			BOD, POR, TIMER(4), WDT	25 MHz	30	260	7 mm		4096	CMOS	8-Ch 10-Bit		3.3 V	NO			I2C, SPI, UART	FLASH	.65 mm		S-PQCC-N33	3		50 rpm		e4	8	28
LPC11U35FHN33/401	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	1.8 V	85 Cel	CORTEX-M0		-40 Cel		YES	QUAD	YES		1 mm	65536	7 mm					25 MHz		260	7 mm		10240	CMOS			3.3 V	NO		Microcontrollers		FLASH	.65 mm		S-PQCC-N33	3	Not Qualified	50 rpm			8	26
935289655551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
935289653551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
935289656518	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
EM783-TP	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		YES	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.6 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	NO	QUAD	NO	1-Ch 10-Bit	1 mm	32768	7 mm	4K			BOD, POR, TIMER(3), TEMPERATURE SENSOR, WDT	25 MHz			7 mm		8192	CMOS			3.3 V	NO			I2C, RS485, SPI, SSP, USART	FLASH	.65 mm		S-PQCC-N33	3		48 rpm		e4	8	22
935289655518	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
935295012518	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
935289655118	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
935304008551	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel			-40 Cel		YES	QUAD	YES		.85 mm	32768	5 mm	0	SEATED HGT-NOM		BOD, COMPARATOR, CRC, DMA(18), MRT(4), PMU, POR, PWM, WDT	25 MHz			5 mm		8192	CMOS	12-Ch 12-Bit		3.3 V	YES			I2C(4), SPI(2), USART(3)	FLASH	.5 mm		S-PQCC-N33	3		30 rpm			8	29
935304008518	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel			-40 Cel		YES	QUAD	YES		.85 mm	32768	5 mm	0	SEATED HGT-NOM		BOD, COMPARATOR, CRC, DMA(18), MRT(4), PMU, POR, PWM, WDT	25 MHz			5 mm		8192	CMOS	12-Ch 12-Bit		3.3 V	YES			I2C(4), SPI(2), USART(3)	FLASH	.5 mm		S-PQCC-N33	3		30 rpm			8	29
935295011551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
EM783-SC	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		YES	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.6 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	NO	QUAD	NO	1-Ch 10-Bit	1 mm	32768	7 mm	4K			BOD, POR, TIMER(3), TEMPERATURE SENSOR, WDT	25 MHz			7 mm		8192	CMOS			3.3 V	NO			I2C, RS485, SPI, SSP, USART	FLASH	.65 mm		S-PQCC-N33	3		48 rpm		e4	8	22
935295012551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
EM783-MC6	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		YES	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.6 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	NO	QUAD	NO	1-Ch 10-Bit	1 mm	32768	7 mm	4K			BOD, POR, TIMER(3), TEMPERATURE SENSOR, WDT	25 MHz			7 mm		8192	CMOS			3.3 V	NO			I2C, RS485, SPI, SSP, USART	FLASH	.65 mm		S-PQCC-N33	3		48 rpm		e4	8	22
935289654551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1 mm		7 mm					25 MHz	30	260	7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33	3		72 rpm		e4		25
935289656551	NXP Semiconductors	MICROCONTROLLER	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		NO	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel			-40 Cel		YES	QUAD	NO		1 mm		7 mm					25 MHz			7 mm			CMOS			3.3 V	NO				FLASH	.65 mm		S-PQCC-N33			72 rpm				25
EM783-MC3	NXP Semiconductors	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		YES	32		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.6 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	NO	QUAD	NO	1-Ch 10-Bit	1 mm	32768	7 mm	4K			BOD, POR, TIMER(3), TEMPERATURE SENSOR, WDT	25 MHz			7 mm		8192	CMOS			3.3 V	NO			I2C, RS485, SPI, SSP, USART	FLASH	.65 mm		S-PQCC-N33	3		48 rpm		e4	8	22

Microcontrollers

A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.

Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.

Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.

One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.