33 Microcontrollers 167

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

LPC1346FHN33,551

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

2 V

85 Cel

CORTEX-M3

-40 Cel

YES

QUAD

NO

1 mm

49152

7 mm

0

25 MHz

30

260

7 mm

8192

CMOS

3.3 V

NO

Microcontrollers

FLASH

.65 mm

S-PQCC-N33

3

Not Qualified

72 rpm

26

LPC1113FHN33/302,5

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

1.8 V

85 Cel

CORTEX-M0

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

NO

24576

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

30

260

7 mm

8192

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI, UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

e4

8

28

LPC1112FHN33/202,5

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

1.8 V

85 Cel

CORTEX-M0

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

NO

16384

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

30

260

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI, UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

e4

8

28

LPC1112FHN33/101

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

NO

1 mm

7 mm

0

25 MHz

30

260

7 mm

CMOS

3.3 V

NO

FLASH

.65 mm

S-PQCC-N33

3

Not Qualified

50 rpm

e4

28

LPC1113FHN33/203,5

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

1.8 V

85 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

24576

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

260

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

8

28

LPC1114FHN33/333

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

YES

QUAD

NO

1 mm

7 mm

0

25 MHz

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

3.3 V

NO

FLASH

.65 mm

S-PQCC-N33

50 rpm

28

LPC1114FHN33/301,551

NXP Semiconductors

MICROCONTROLLER, RISC

NO LEAD

33

HVQCCN

SQUARE

YES

3.6 V

0

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

YES

QUAD

NO

7 mm

0

25 MHz

7 mm

3.3 V

NO

.65 mm

50 rpm

28

LPC1346FHN33

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

85 Cel

-40 Cel

YES

QUAD

NO

1 mm

7 mm

0

25 MHz

7 mm

CMOS

3.3 V

YES

FLASH

.65 mm

S-PQCC-N33

3

72 rpm

8

28

LPC1311FHN33,551

NXP Semiconductors

MICROCONTROLLER

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

2 V

85 Cel

ARM7

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

NO

1 mm

8192

7 mm

0

BOD, POR, TIMER(5), WDT(2)

0

25 MHz

30

260

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, MICROWIRE, RS485, SPI, SSI, SSP, UART

FLASH

.65 mm

S-PQCC-N33

3

Not Qualified

72 rpm

e4

8

28

LPC1112JHN33/203

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

105 Cel

-40 Cel

YES

QUAD

NO

1 mm

16384

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N33

50 rpm

8

28

LPC1114JHN33/333E

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

1.8 V

105 Cel

CORTEX-M0

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

NO

57344

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

30

260

7 mm

8192

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

e4

8

28

LPC1111FHN33/203,5

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

1.8 V

85 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

8192

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

260

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

8

28

LPC1114FHN33/203

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

YES

QUAD

NO

1 mm

7 mm

0

25 MHz

7 mm

CMOS

3.3 V

NO

FLASH

.65 mm

S-PQCC-N33

50 rpm

28

LPC834M101FHI33

NXP Semiconductors

MICROCONTROLLER, RISC

NO LEAD

33

HVQCCN

SQUARE

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M0+

-40 Cel

YES

QUAD

YES

32768

5 mm

0

BOD, DMA(18), POR, RTC, TIMER(7), WDT

0

25 MHz

5 mm

4096

CMOS

12-Ch 12-Bit

3.3 V

YES

I2C, SPI(2), USART

FLASH

.5 mm

30 rpm

8

29

LPC1113JHN33/203E

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

1.8 V

105 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

24576

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

260

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

8

28

LPC1111FHN33/202

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

YES

QUAD

NO

1 mm

7 mm

0

25 MHz

7 mm

CMOS

3.3 V

NO

FLASH

.65 mm

S-PQCC-N33

50 rpm

28

LPC1113FHN33/202

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

1 mm

24576

7 mm

0

BOD, POR, TIMER(4), WDT

0

25 MHz

7 mm

4096

CMOS

8-Ch 10-Bit

3.3 V

NO

I2C, SPI, UART

FLASH

.65 mm

S-PQCC-N33

50 rpm

8

28

LPC1114FHI33/302,5

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

85 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

32768

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

260

7 mm

8192

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI, UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

8

28

LPC1112FHI33/102,5

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

85 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

16384

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

260

7 mm

2048

CMOS

8-Ch 10-Bit

3.3 V

NO

Microcontrollers

I2C, SPI, UART

FLASH

.65 mm

S-PQCC-N32

3

Not Qualified

50 rpm

8

28

LPC1114FHI33/303

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M0

-40 Cel

YES

QUAD

NO

1 mm

32768

7 mm

0

BOD, POR, TIMER(4), WDT

0

25 MHz

7 mm

8192

CMOS

8-Ch 10-Bit

3.3 V

NO

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N33

50 rpm

8

28

LPC1114FHN33/201

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

NO

1 mm

7 mm

0

25 MHz

30

260

7 mm

CMOS

3.3 V

NO

FLASH

.65 mm

S-PQCC-N33

3

Not Qualified

50 rpm

e4

28

LPC1114JHN33/333

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

105 Cel

-40 Cel

YES

QUAD

NO

1 mm

57344

7 mm

0

BOD, POR, TIMER(5), WDT

0

25 MHz

7 mm

8192

CMOS

8-Ch 10-Bit

3.3 V

NO

I2C, SPI(2), UART

FLASH

.65 mm

S-PQCC-N33

50 rpm

8

28

LPC1114JHI33/303

NXP Semiconductors

MICROCONTROLLER, RISC

INDUSTRIAL

NO LEAD

33

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

32

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

105 Cel

-40 Cel

YES

QUAD

NO

.85 mm

32768

5 mm

0

SEATED HGT-NOM

BOD, POR, TIMER(5), WDT

0

25 MHz

5 mm

8192

CMOS

8-Ch 10-Bit

3.3 V

NO

I2C, SPI(2), UART

FLASH

.5 mm

S-PQCC-N33

50 rpm

8

28

Microcontrollers

A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.

Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.

Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.

One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.