Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROCONTROLLER |
INDUSTRIAL |
BALL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA121,11X11,25 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
262144 |
8 mm |
0 |
50 MHz |
40 |
260 |
8 mm |
65536 |
CMOS |
34 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B121 |
3 |
Not Qualified |
72 rpm |
e1 |
74 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA64,8X8,20 |
1.71 V |
105 Cel |
CORTEX-M0 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
262144 |
5 mm |
0 |
48 MHz |
40 |
260 |
5 mm |
32768 |
CMOS |
8.3 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
.5 mm |
S-PBGA-B64 |
3 |
Not Qualified |
48 rpm |
e1 |
54 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
364 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
YES |
16 |
3.3 |
GRID ARRAY |
BGA364,20X20,32 |
1.16 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
17 mm |
16 |
40 |
260 |
17 mm |
1572864 |
CMOS |
850 mA |
1.23 V |
NO |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B364 |
3 |
Not Qualified |
400 rpm |
e1 |
131 |
|||||||||||||||||||||||||||||
Infineon Technologies |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
8 |
24 |
NO |
32 |
1.5,2.5/3.3,3.3 |
GRID ARRAY |
BGA416,26X26,40 |
1.42 V |
125 Cel |
TC1M |
-40 Cel |
YES |
BOTTOM |
YES |
2.5 mm |
2097152 |
27 mm |
128K |
YES |
DMA(16), POR, TIMER(3), WDT |
32 |
40 MHz |
27 mm |
3 |
262144 |
CMOS |
44-Ch 10-Bit |
700 mA |
1.5 V |
16 |
NO |
6 |
Microcontrollers |
ASC(2), CAN(4), MLI(2), MSC(2), SSC(2) |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B416 |
Not Qualified |
150 rpm |
YES |
8 |
123 |
||||||||||||||||||
Infineon Technologies |
MICROCONTROLLER |
OTHER |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.58 V |
24 |
NO |
32 |
1.5,2.5/3.3,3.3 |
GRID ARRAY |
BGA416,26X26,40 |
1.42 V |
125 Cel |
-10 Cel |
YES |
BOTTOM |
YES |
2.5 mm |
131072 |
27 mm |
32 |
40 MHz |
250 |
27 mm |
65536 |
CMOS |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
150 rpm |
127 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROCONTROLLER |
OTHER |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.58 V |
24 |
NO |
32 |
1.5,2.5/3.3,3.3 |
GRID ARRAY |
BGA416,26X26,40 |
1.42 V |
125 Cel |
-10 Cel |
YES |
BOTTOM |
YES |
2.5 mm |
2097152 |
27 mm |
32 |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
65536 |
CMOS |
700 mA |
1.5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
Not Qualified |
150 rpm |
127 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
208 |
BGA |
SQUARE |
PLASTIC |
YES |
1.65 V |
AEC-Q100 |
0 |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA208,16X16,40 |
1.35 V |
125 Cel |
E200 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
20 MHz |
40 |
260 |
17 mm |
65536 |
CMOS |
250 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B208 |
3 |
Not Qualified |
80 rpm |
e1 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
8 |
20 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA324,22X22,40 |
1.35 V |
125 Cel |
MPC500 |
1 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
2.55 mm |
2097152 |
23 mm |
0 |
A/D CONVERTER OF 40-CH IS AVAILABLE |
YES |
POR |
16 |
40 MHz |
40 |
260 |
23 mm |
81920 |
CMOS |
600 mA |
1.5 V |
YES |
1 |
Microcontrollers |
CAN, SCI, SPI |
FLASH |
1 mm |
FLOATING POINT |
S-PBGA-B324 |
3 |
Not Qualified |
132 rpm |
YES |
e1 |
8 |
||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
22 |
32 |
GRID ARRAY |
1.14 V |
TIN SILVER |
YES |
BOTTOM |
YES |
17 mm |
16 |
40 MHz |
40 |
260 |
17 mm |
CMOS |
1.2 V |
YES |
.5 mm |
S-PBGA-B208 |
3 |
Not Qualified |
150 rpm |
e2 |
120 |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY |
1.2 V |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. |
DMA(128), PWM, TEMPERATURE SENSOR |
0 |
40 MHz |
40 |
260 |
27 mm |
524288 |
CMOS |
YES |
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) |
FLASH |
1 mm |
S-PBGA-B516 |
3 |
264 rpm |
e2 |
8 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
0 |
NO |
32 |
GRID ARRAY |
BGA416,26X26,40 |
1.2 V |
125 Cel |
E200Z7 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. |
YES |
POR |
0 |
40 MHz |
40 |
260 |
27 mm |
0 |
524288 |
CMOS |
1350 mA |
128 |
YES |
5 |
CAN(4), SCI(5), SPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B416 |
3 |
264 rpm |
YES |
e2 |
8 |
||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY |
1.2 V |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. |
DMA(128), PWM, TEMPERATURE SENSOR |
0 |
40 MHz |
40 |
260 |
27 mm |
524288 |
CMOS |
YES |
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) |
FLASH |
1 mm |
S-PBGA-B516 |
3 |
264 rpm |
e2 |
8 |
||||||||||||||||||||||||||||
Infineon Technologies |
MICROCONTROLLER |
BALL |
292 |
BGA |
SQUARE |
YES |
0 |
NO |
32 |
GRID ARRAY |
YES |
BOTTOM |
YES |
17 mm |
0 |
17 mm |
3.3 V |
NO |
.8 mm |
300 rpm |
0 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.26 V |
16 |
22 |
YES |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
125 Cel |
TMS320 |
8 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2.1 mm |
8192 |
516 |
17 mm |
0 |
IT ALSO OPERATES AT 3.3V |
YES |
"DMA(6), PWM(18), TIMER(18), WDT" |
32 |
300 MHz |
30 |
260 |
17 mm |
18 |
528384 |
CMOS |
1.2 V |
6 |
YES |
2 |
Microcontrollers |
"CAN(2), I2C, SCI(3), SPI(4)" |
MROM |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
Not Qualified |
300 rpm |
YES |
e1 |
16 |
88 |
|||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
32 |
2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.2 V |
105 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
524288 |
17 mm |
0 |
25 MHz |
30 |
260 |
17 mm |
139264 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
e1 |
164 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
144 |
BGA |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
0 |
NO |
32 |
3.3 |
GRID ARRAY |
BGA144,12X12,40 |
3 V |
70 Cel |
COLDFIRE |
0 Cel |
YES |
BOTTOM |
YES |
262144 |
13 mm |
0 |
80 MHz |
40 |
260 |
13 mm |
32768 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-XBGA-B144 |
3 |
Not Qualified |
80 rpm |
e2 |
96 |
||||||||||||||||||||||||||||
|
Freescale Semiconductor |
COMMERCIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
GRID ARRAY |
BGA144,12X12,40 |
70 Cel |
COLDFIRE |
0 Cel |
Matte Tin (Sn) |
BOTTOM |
262144 |
40 |
260 |
32768 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B144 |
3 |
Not Qualified |
80 rpm |
e3 |
||||||||||||||||||||||||||||||||||||||||
|
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
262144 |
40 |
260 |
65536 |
CMOS |
200 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
121 |
BGA |
SQUARE |
YES |
3.6 V |
0 |
32 |
GRID ARRAY |
1.71 V |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
8 mm |
0 |
32 MHz |
40 |
260 |
8 mm |
CMOS |
3.3 V |
YES |
.65 mm |
3 |
50 rpm |
e1 |
64 |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
80 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY |
BGA80,8X10,16 |
1.71 V |
85 Cel |
CORTEX-M4F |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
524288 |
3.56 mm |
0 |
50 MHz |
40 |
260 |
4.13 mm |
131072 |
CMOS |
36.93 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
.8 mm |
R-PBGA-B80 |
1 |
Not Qualified |
120 rpm |
e1 |
52 |
||||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER, RISC |
MILITARY |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
NO |
32 |
GRID ARRAY |
3 V |
125 Cel |
-55 Cel |
YES |
BOTTOM |
NO |
2.65 mm |
27 mm |
ALSO REQUIRES 5V SUPPLY |
32 |
20 MHz |
27 mm |
HCMOS |
3.3 V |
YES |
FLASH |
1.27 mm |
S-PBGA-B272 |
Not Qualified |
40 rpm |
101 |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
24 |
NO |
32 |
2.6,5 |
GRID ARRAY |
BGA388,26X26,40 |
2.5 V |
125 Cel |
-40 Cel |
TIN LEAD |
NO |
BOTTOM |
NO |
2.55 mm |
27 mm |
32 |
20 MHz |
30 |
240 |
27 mm |
32768 |
CMOS |
2.6 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B388 |
3 |
Not Qualified |
56 rpm |
e0 |
16 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
24 |
32 |
2.6,5 |
GRID ARRAY |
BGA388,26X26,40 |
2.5 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
524288 |
27 mm |
16 |
25 MHz |
40 |
260 |
27 mm |
32768 |
CMOS |
2.6 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B388 |
3 |
Not Qualified |
56 rpm |
e1 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
30 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.425 V |
TIN SILVER |
NO |
BOTTOM |
YES |
27 mm |
64 |
66.7 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
NO |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
400 rpm |
e2 |
57 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
30 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.425 V |
70 Cel |
0 Cel |
TIN SILVER |
NO |
BOTTOM |
YES |
27 mm |
64 |
66.7 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
NO |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
400 rpm |
e2 |
57 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
30 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.425 V |
TIN SILVER |
NO |
BOTTOM |
YES |
27 mm |
64 |
66.7 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
NO |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
400 rpm |
e2 |
57 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
30 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.425 V |
70 Cel |
0 Cel |
TIN SILVER |
NO |
BOTTOM |
YES |
27 mm |
64 |
66.7 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
NO |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
266 rpm |
e2 |
57 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
AEC-Q100 |
24 |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA416,26X26,40 |
1.35 V |
125 Cel |
E200 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
3145728 |
27 mm |
32 |
20 MHz |
40 |
260 |
27 mm |
131072 |
CMOS |
785 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
135 rpm |
e1 |
256 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
32 |
32 |
1.2,3.3,5 |
GRID ARRAY |
BGA208,16X16,40 |
1.14 V |
150 Cel |
E200Z335 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
1572864 |
17 mm |
64 |
20 MHz |
40 |
260 |
17 mm |
96256 |
CMOS |
195 mA |
1.2 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B208 |
3 |
Not Qualified |
80 rpm |
e2 |
80 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY |
1.2 V |
TIN SILVER |
YES |
BOTTOM |
YES |
27 mm |
0 |
40 MHz |
40 |
260 |
27 mm |
YES |
1 mm |
3 |
264 rpm |
e2 |
||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
0 |
NO |
32 |
GRID ARRAY |
BGA516,26X26,40 |
1.2 V |
125 Cel |
E200Z7 |
1 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. |
YES |
POR |
0 |
40 MHz |
40 |
260 |
27 mm |
0 |
524288 |
CMOS |
1350 mA |
128 |
YES |
5 |
CAN(4), SCI(5), SPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B516 |
3 |
264 rpm |
YES |
e2 |
8 |
||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.38 V |
ISO 26262 |
32 |
NO |
32 |
GRID ARRAY |
1.19 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2.55 mm |
8388608 |
27 mm |
544K |
INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM) |
DMA(128), TIMER(8), WDT(4) |
32 |
40 MHz |
40 |
260 |
27 mm |
413696 |
CMOS |
12-Ch 12-Bit, 10-Ch 16-Bit |
1.325 V |
NO |
CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3) |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
300 rpm |
e1 |
8 |
0 |
||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
BALL |
90 |
BGA |
RECTANGULAR |
YES |
3.6 V |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.8 V |
YES |
BOTTOM |
YES |
3.934 mm |
0 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
4.188 mm |
3.3 V |
YES |
.4 mm |
168 rpm |
72 |
|||||||||||||||||||||||||||||||||||||||||||||
Advanced Micro Devices |
MICROCONTROLLER |
INDUSTRIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.625 V |
32 |
NO |
32 |
GRID ARRAY |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
NO |
BOTTOM |
YES |
2.46 mm |
35 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
32 |
33.33 MHz |
250 |
35 mm |
CMOS |
2.5 V |
NO |
FLASH |
1.27 mm |
S-PBGA-B388 |
4 |
Not Qualified |
100 rpm |
e0 |
32 |
|||||||||||||||||||||||||||||||||
Freescale Semiconductor |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
85 Cel |
COLDFIRE |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
524288 |
40 |
260 |
65536 |
CMOS |
200 mA |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
66 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROCONTROLLER, RISC |
BALL |
272 |
BGA |
SQUARE |
YES |
3.6 V |
22 |
32 |
GRID ARRAY |
3 V |
YES |
BOTTOM |
YES |
21 mm |
16 |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
21 mm |
CMOS |
3.3 V |
YES |
1 mm |
200 rpm |
144 |
||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROCONTROLLER, RISC |
BALL |
400 |
BGA |
SQUARE |
YES |
1.2 V |
0 |
32 |
GRID ARRAY |
1.1 V |
YES |
BOTTOM |
YES |
17 mm |
0 |
17 mm |
1.15 V |
NO |
.8 mm |
3 |
500 rpm |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROCONTROLLER |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.43 V |
8 |
ISO 26262 |
NO |
32 |
GRID ARRAY |
BGA416,26X26,40 |
1.235 V |
150 Cel |
TC29X |
-40 Cel |
NICKEL GOLD |
YES |
BOTTOM |
YES |
2.15 mm |
8388608 |
27 mm |
131072 |
YES |
DMA(128), POR, RTC, TIMER(3), WDT |
40 MHz |
27 mm |
3 |
745472 |
CMOS |
94-Ch 12-Bit |
290 mA |
1.3 V |
128 |
YES |
ASCLIN(4), CAN(6), I2C(2), I2S, LIN(6), PSI5(5), PSI5S, SPI,(4), QSPI(5) |
FLASH |
1 mm |
FLOATING-POINT |
S-PBGA-B416 |
3 |
300 rpm |
YES |
e4 |
8 |
|||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY |
1.2 V |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. |
DMA(128), PWM, TEMPERATURE SENSOR |
0 |
40 MHz |
40 |
260 |
27 mm |
524288 |
CMOS |
YES |
CAN(4), DSPI(5), EBI, ETHERNET, SCI(5) |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
264 rpm |
e2 |
8 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY |
1.2 V |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. |
DMA(128), PWM, TEMPERATURE SENSOR |
0 |
40 MHz |
40 |
260 |
27 mm |
524288 |
CMOS |
YES |
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
264 rpm |
e2 |
8 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY |
1.2 V |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. |
DMA(128), PWM, TEMPERATURE SENSOR |
0 |
40 MHz |
40 |
260 |
27 mm |
524288 |
CMOS |
YES |
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) |
FLASH |
1 mm |
S-PBGA-B516 |
3 |
264 rpm |
e2 |
8 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
NO |
32 |
GRID ARRAY |
1.2 V |
125 Cel |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
2.02 mm |
8388608 |
27 mm |
0 |
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. |
DMA(128), PWM, TEMPERATURE SENSOR |
0 |
40 MHz |
40 |
260 |
27 mm |
524288 |
CMOS |
YES |
CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) |
FLASH |
1 mm |
S-PBGA-B516 |
3 |
264 rpm |
e2 |
8 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
24 |
NO |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA416,26X26,40 |
1.35 V |
125 Cel |
-40 Cel |
TIN LEAD |
YES |
BOTTOM |
YES |
2.55 mm |
3145728 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
32 |
20 MHz |
40 |
260 |
27 mm |
131072 |
CMOS |
820 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
144 rpm |
e0 |
256 |
||||||||||||||||||||||||||
|
Marvell Technology |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
288 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
0 |
NO |
32 |
GRID ARRAY |
.95 V |
125 Cel |
-40 Cel |
NO |
BOTTOM |
YES |
2.1 mm |
19 mm |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
CMOS |
1 V |
NO |
FLASH |
1 mm |
S-PBGA-B288 |
1200 rpm |
50 |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
30 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.425 V |
TIN SILVER |
NO |
BOTTOM |
YES |
27 mm |
64 |
66.7 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
NO |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
300 rpm |
e2 |
57 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
AEC-Q100 |
24 |
32 |
1.5,3.3,5 |
GRID ARRAY |
BGA416,26X26,40 |
1.35 V |
125 Cel |
E200 |
-40 Cel |
YES |
BOTTOM |
YES |
3145728 |
27 mm |
32 |
20 MHz |
40 |
260 |
27 mm |
131072 |
CMOS |
545 mA |
1.5 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B416 |
3 |
Not Qualified |
82 rpm |
256 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
AEC-Q100 |
32 |
NO |
32 |
5 |
GRID ARRAY |
BGA208,16X16,40 |
4.5 V |
105 Cel |
E200 |
-40 Cel |
TIN SILVER |
YES |
BOTTOM |
YES |
262144 |
17 mm |
32 |
16 MHz |
40 |
260 |
17 mm |
65536 |
CMOS |
5 V |
NO |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B208 |
3 |
Not Qualified |
66 rpm |
e2 |
130 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
30 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.425 V |
70 Cel |
0 Cel |
TIN SILVER |
NO |
BOTTOM |
YES |
27 mm |
64 |
66.7 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
NO |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B516 |
3 |
Not Qualified |
266 rpm |
e2 |
57 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.