Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP28,.6 |
100 Cel |
TMS370 |
-55 Cel |
DUAL |
4096 |
128 |
CMOS |
36 mA |
5 V |
Microcontrollers |
UVPROM |
2.54 mm |
R-XDIP-T28 |
Not Qualified |
5 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
95 Cel |
MSP430 |
-55 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1 mm |
131072 |
9 mm |
0 |
COMPARATOR, DMA(3), LCD, RTC, TIMER(5), WDT |
0 |
24 MHz |
30 |
260 |
9 mm |
2048 |
CMOS |
16-Ch 12-Bit |
3 V |
YES |
I2C, IRDA, SCI(4), SPI(2), UART |
FRAM |
.5 mm |
S-PQCC-N64 |
3 |
16 rpm |
e4 |
8 |
48 |
|||||||||||||||||||||||||
Texas Instruments |
OTHER |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC |
YES |
8 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
25 Cel |
TMS370 |
25 Cel |
QUAD |
16384 |
512 |
CMOS |
95 mA |
5 V |
Microcontrollers |
UVPROM |
1.27 mm |
S-XQCC-J68 |
Not Qualified |
5 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
25 Cel |
TMS370 |
25 Cel |
QUAD |
4096 |
256 |
CMOS |
80 mA |
5 V |
Microcontrollers |
EEPROM |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
5 rpm |
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|
Texas Instruments |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
0 |
NO |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 V |
85 Cel |
MSP430 |
0 |
-55 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1 mm |
16384 |
1 |
6 mm |
0 |
YES |
BOD, COMPARATOR, DMA(3), POR, RTC, TIMER(5), WDT |
0 |
24 MHz |
30 |
260 |
6 mm |
5 |
1024 |
CMOS |
14-Ch 10-Bit |
4.3 mA |
3.3 V |
3 |
YES |
2 |
I2C, IRDA(2), SCI(3), SPI(3), UART(2) |
FRAM |
.5 mm |
FIXED POINT |
S-PQCC-N40 |
3 |
24 rpm |
YES |
e4 |
8 |
32 |
||||||||||||||
Texas Instruments |
OTHER |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC |
YES |
8 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
25 Cel |
TMS370 |
25 Cel |
QUAD |
16384 |
512 |
CMOS |
95 mA |
5 V |
Microcontrollers |
UVPROM |
1.27 mm |
S-XQCC-J68 |
Not Qualified |
5 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
0 |
NO |
16 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
MSP430 |
0 |
-55 Cel |
NICKEL PALLADIUM GOLD |
YES |
QUAD |
YES |
1 mm |
16384 |
1 |
6 mm |
0 |
YES |
BOD, COMPARATOR, DMA(3), POR, RTC, TIMER(5), WDT |
0 |
24 MHz |
30 |
260 |
6 mm |
5 |
1024 |
CMOS |
14-Ch 10-Bit |
4.3 mA |
3.3 V |
3 |
YES |
2 |
Microcontrollers |
I2C, IRDA(2), SCI(3), SPI(3), UART(2) |
FRAM |
.5 mm |
FIXED POINT |
S-PQCC-N40 |
3 |
24 rpm |
YES |
e4 |
8 |
32 |
|||||||||||
|
Texas Instruments |
MICROCONTROLLER, RISC |
OTHER |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
1.8 V |
105 Cel |
MSP430 |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
YES |
QUAD |
YES |
1.2 mm |
0 |
7 mm |
0 |
COMPARATOR(16), DMA, RTC, TIMER(5) |
0 |
24 MHz |
30 |
260 |
7 mm |
2048 |
CMOS |
16-Ch 12-Bit |
3 V |
YES |
I2C, SPI(3), UART(2) |
FRAM |
.5 mm |
S-PQFP-G48 |
3 |
16 rpm |
e4 |
40 |
||||||||||||||||||||||||||
Texas Instruments |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 V |
85 Cel |
-55 Cel |
YES |
QUAD |
YES |
1 mm |
16384 |
6 mm |
0 |
BOR, COMPARATOR, DMA(3), POR, RTC, TIMER(5), WDT |
0 |
24 MHz |
6 mm |
1024 |
CMOS |
14-Ch 10-Bit |
3.3 V |
YES |
I2C, IRDA, SPI(2), UART |
FRAM |
.5 mm |
S-PQCC-N40 |
24 rpm |
8 |
32 |
||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
25 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.7 V |
70 Cel |
-20 Cel |
NO |
BOTTOM |
NO |
.69 mm |
1.945 mm |
0 |
12 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
1.995 mm |
CMOS |
1.8 V |
NO |
FLASH |
.35 mm |
R-PBGA-B25 |
12 rpm |
16 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
16 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.67 V |
70 Cel |
-20 Cel |
NO |
BOTTOM |
NO |
.69 mm |
1.998 mm |
0 |
12 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
2.057 mm |
CMOS |
3.3 V |
NO |
FLASH |
.4 mm |
R-PBGA-B16 |
12 rpm |
10 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
108 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA108,12X12,20 |
3 V |
95 Cel |
ARM7 |
-10 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
12-Ch 12-Bit |
1.4 mm |
64512 |
7 mm |
0 |
POR, PWM, TIMER(4), WDT |
0 |
41.78 MHz |
30 |
260 |
7 mm |
8192 |
CMOS |
13-Ch 12-Bit |
40 mA |
3.3 V |
YES |
Microcontrollers |
I2C(2), SPI, UART |
FLASH |
.5 mm |
S-PBGA-B108 |
3 |
Not Qualified |
41.78 rpm |
e1 |
16 |
32 |
|||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
112 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.9 V |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
8-Ch 12-Bit |
1.2 mm |
262144 |
6 mm |
0 |
DMA(14), POR, PWM, TEMPERATURE SENSOR, TIMER(4), WDT |
0 |
6 mm |
32768 |
CMOS |
22-Ch 14-Bit |
3.3 V |
YES |
I2C(2), SPI(2), UART |
FLASH |
.5 mm |
S-PBGA-B112 |
3 |
80 rpm |
e1 |
8 |
28 |
||||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
108 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA108,12X12,20 |
3 V |
95 Cel |
ARM7 |
-10 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
12-Ch 12-Bit |
1.4 mm |
64512 |
7 mm |
0 |
POR, PWM, TIMER(4), WDT |
0 |
41.78 MHz |
30 |
260 |
7 mm |
8192 |
CMOS |
13-Ch 12-Bit |
40 mA |
3.3 V |
YES |
Microcontrollers |
I2C(2), SPI, UART |
FLASH |
.5 mm |
S-PBGA-B108 |
3 |
Not Qualified |
41.78 rpm |
e1 |
16 |
32 |
|||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
108 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA108,12X12,20 |
3 V |
95 Cel |
ARM7 |
-10 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
1.4 mm |
129024 |
7 mm |
0 |
41.78 MHz |
30 |
260 |
7 mm |
8192 |
CMOS |
40 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
.5 mm |
S-PBGA-B108 |
3 |
Not Qualified |
41.78 rpm |
e1 |
32 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
112 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.9 V |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
8-Ch 12-Bit |
1.2 mm |
262144 |
6 mm |
0 |
DMA(14), POR, PWM, TEMPERATURE SENSOR, TIMER(4), WDT |
0 |
30 |
260 |
6 mm |
32768 |
CMOS |
22-Ch 14-Bit |
3.3 V |
YES |
I2C(2), SPI(2), UART |
FLASH |
.5 mm |
S-PBGA-B112 |
3 |
80 rpm |
e1 |
8 |
28 |
||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
1048576 |
3.948 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
4.108 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
R-PBGA-B81 |
1 |
96 rpm |
e2 |
8 |
49 |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
1.2,1.8,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA81,9X9,16 |
1.14 V |
85 Cel |
CORTEX-M4F |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
3.948 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
4.108 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
Microcontrollers |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
R-PBGA-B81 |
1 |
Not Qualified |
96 rpm |
e2 |
8 |
49 |
|||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
1.2,1.8,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA81,9X9,16 |
1.14 V |
85 Cel |
CORTEX-M4F |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
3.948 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
4.108 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
Microcontrollers |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
R-PBGA-B81 |
1 |
Not Qualified |
96 rpm |
e2 |
8 |
49 |
|||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
1.2,1.8,3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
1.14 V |
85 Cel |
CORTEX-M4F |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
1.2 mm |
2097152 |
14 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
14 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
Microcontrollers |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
96 rpm |
e3 |
8 |
49 |
|||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
262144 |
3.068 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
3.868 mm |
131072 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
R-PBGA-B63 |
1 |
96 rpm |
e2 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
1.2,1.8,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA81,9X9,16 |
1.14 V |
85 Cel |
CORTEX-M4F |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
3.948 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
4.108 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
Microcontrollers |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
R-PBGA-B81 |
1 |
Not Qualified |
96 rpm |
e2 |
8 |
49 |
|||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
4.4 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
48 MHz |
30 |
260 |
4.4 mm |
524288 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
S-PBGA-B100 |
1 |
96 rpm |
e2 |
8 |
66 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
NO |
32 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
.8 mm |
524288 |
8 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
8 mm |
163840 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
S-XQCC-N68 |
3 |
96 rpm |
e3 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-20 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
1.2 mm |
2097152 |
14 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
14 mm |
524288 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.5 mm |
S-PQFP-G100 |
3 |
96 rpm |
e3 |
8 |
62 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
262144 |
3.068 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
3.868 mm |
131072 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
R-PBGA-B63 |
1 |
96 rpm |
e2 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
4.4 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
48 MHz |
30 |
260 |
4.4 mm |
524288 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
S-PBGA-B100 |
1 |
96 rpm |
e2 |
8 |
66 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
1.2,1.8,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA81,9X9,16 |
1.14 V |
85 Cel |
CORTEX-M4F |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
3.948 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
4.108 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
Microcontrollers |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
R-PBGA-B81 |
1 |
Not Qualified |
96 rpm |
e2 |
8 |
49 |
|||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
524288 |
3.068 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
3.868 mm |
163840 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
R-PBGA-B63 |
1 |
96 rpm |
e2 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
NO |
32 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
.8 mm |
262144 |
8 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
8 mm |
131072 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
S-XQCC-N68 |
3 |
96 rpm |
e3 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
NO |
32 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
.8 mm |
524288 |
8 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
8 mm |
163840 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
S-XQCC-N68 |
3 |
96 rpm |
e3 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
2097152 |
4.4 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
48 MHz |
30 |
260 |
4.4 mm |
524288 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
S-PBGA-B100 |
1 |
96 rpm |
e2 |
8 |
66 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
NO |
32 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
.8 mm |
524288 |
8 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
8 mm |
163840 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
S-XQCC-N68 |
3 |
96 rpm |
e3 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
524288 |
3.068 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
3.868 mm |
163840 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
R-PBGA-B63 |
1 |
96 rpm |
e2 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-30 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
.69 mm |
1048576 |
3.948 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED |
POR, RTC, TIMER(7), WDT(3) |
0 |
30 |
260 |
4.108 mm |
262144 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.4 mm |
R-PBGA-B81 |
1 |
96 rpm |
e2 |
8 |
49 |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
NO |
32 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
.8 mm |
262144 |
8 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
8 mm |
131072 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
S-XQCC-N68 |
3 |
96 rpm |
e3 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
0 |
NO |
32 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-30 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
.8 mm |
524288 |
8 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
8 mm |
163840 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(3), SPI(5), UART(3), USB |
FLASH |
.4 mm |
S-XQCC-N68 |
3 |
96 rpm |
e3 |
8 |
40 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROCONTROLLER, RISC |
OTHER |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
NO |
32 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-20 Cel |
Matte Tin (Sn) - annealed |
YES |
QUAD |
YES |
1.2 mm |
2097152 |
14 mm |
0 |
ALSO REQUIRES 1.8V NOM SUPPLY |
POR, RTC, TIMER(7), WDT(3) |
0 |
.032 MHz |
30 |
260 |
14 mm |
524288 |
CMOS |
4-Ch 10-Bit |
1.2 V |
YES |
I2C(4), SPI(5), UART(4), USB |
FLASH |
.5 mm |
S-PQFP-G100 |
3 |
96 rpm |
e3 |
8 |
62 |
|||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
FLATPACK |
3 V |
70 Cel |
-30 Cel |
YES |
QUAD |
NO |
3 mm |
14 mm |
ALSO AVAILABLE IN TQFP64J FLGA64 AND FLGA68K PACKAGES; ALSO OPERATES AT 2.2 MIN SUPPLY AT 2 MHZ |
0 |
12 MHz |
14 mm |
CMOS |
5 V |
YES |
FLASH |
.8 mm |
S-PQFP-G64 |
12 rpm |
51 |
||||||||||||||||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
2.5/5 |
FLATPACK, LOW PROFILE |
QFP100,.7X.9 |
2.8 V |
70 Cel |
-30 Cel |
YES |
QUAD |
NO |
49152 |
14 mm |
0 |
20 mm |
1536 |
CMOS |
YES |
Microcontrollers |
MROM |
.65 mm |
R-PQFP-G100 |
Not Qualified |
12 rpm |
89 |
||||||||||||||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
2.5/5 |
FLATPACK, LOW PROFILE |
QFP100,.7X.9 |
2.8 V |
70 Cel |
-30 Cel |
YES |
QUAD |
NO |
73728 |
14 mm |
0 |
20 mm |
2048 |
CMOS |
YES |
Microcontrollers |
MROM |
.65 mm |
R-PQFP-G100 |
Not Qualified |
12 rpm |
89 |
||||||||||||||||||||||||||||||||||||
Onsemi |
OTHER |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
3/5 |
FLATPACK |
QFP80,.7X.9,32 |
70 Cel |
-30 Cel |
QUAD |
32768 |
768 |
CMOS |
25 mA |
Microcontrollers |
MROM |
.8 mm |
R-PQFP-G80 |
Not Qualified |
6 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
3/5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
4.5 V |
70 Cel |
-30 Cel |
YES |
QUAD |
NO |
229376 |
14 mm |
0 |
14 mm |
4096 |
CMOS |
5 V |
YES |
Microcontrollers |
MROM |
.5 mm |
S-PQFP-G100 |
Not Qualified |
20.4 rpm |
81 |
||||||||||||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
FLATPACK |
2.8 V |
70 Cel |
-20 Cel |
YES |
QUAD |
NO |
3 mm |
14 mm |
ALSO AVAILABLE IN TQFP80J PACKAGE |
0 |
12 MHz |
20 mm |
CMOS |
5 V |
YES |
FLASH |
.8 mm |
R-PQFP-G80 |
12 rpm |
63 |
||||||||||||||||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
80 |
LQFP |
RECTANGULAR |
UNSPECIFIED |
NO |
YES |
6 V |
4 |
0 |
NO |
4 |
FLATPACK, LOW PROFILE |
QFP80,.75X1,32 |
4.5 V |
70 Cel |
1 |
-30 Cel |
NO |
QUAD |
NO |
2.15 mm |
6144 |
256 |
14 mm |
0 |
NO |
LCD, TIMER(2), WDT |
0 |
4.2 MHz |
20 mm |
2 |
128 |
CMOS |
1 mA |
5 V |
NO |
MROM |
.8 mm |
FIXED POINT |
R-XQFP-G80 |
4.2 rpm |
16 |
||||||||||||||||||||||||||
Onsemi |
MICROCONTROLLER |
OTHER |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
6 V |
0 |
NO |
4 |
5 |
IN-LINE |
DIP18,.3 |
4.5 V |
70 Cel |
LC6500 |
-30 Cel |
NO |
DUAL |
NO |
512 |
7.62 mm |
0 |
24.2 mm |
16 |
CMOS |
8 mA |
5 V |
NO |
Microcontrollers |
MROM |
2.54 mm |
R-PDIP-T18 |
Not Qualified |
4.33 rpm |
13 |
|||||||||||||||||||||||||||||||||
|
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
2.5/5 |
FLATPACK, LOW PROFILE |
QFP100,.7X.9 |
2.8 V |
70 Cel |
-30 Cel |
YES |
QUAD |
NO |
131072 |
14 mm |
0 |
20 mm |
4096 |
CMOS |
14 mA |
YES |
Microcontrollers |
MROM |
.65 mm |
R-PQFP-G100 |
Not Qualified |
24.4 rpm |
81 |
||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROCONTROLLER |
OTHER |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
NO |
8 |
2.2/5.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
3 V |
70 Cel |
-30 Cel |
YES |
QUAD |
NO |
57344 |
10 mm |
0 |
10 mm |
2048 |
CMOS |
YES |
Microcontrollers |
FLASH |
.5 mm |
S-PQFP-G64 |
Not Qualified |
24.4 rpm |
51 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.