196 Microprocessors 63

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MCF5274LVF166

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

GRID ARRAY, LOW PROFILE

1.4 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

83 MHz

40

260

15 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B196

3

166 rpm

YES

e0

MCF5232CVM100

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

GRID ARRAY, LOW PROFILE

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

LOW POWER MODE TAKEN FROM LOW POWER MODE

YES

32

75 MHz

40

260

15 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

100 rpm

YES

e1

MCF52277CVM166

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

1.5,1.8,2.5,3.3

GRID ARRAY

BGA196,14X14,40

1.4 V

85 Cel

-40 Cel

BOTTOM

1.75 mm

15 mm

YES

32

66.67 MHz

NOT SPECIFIED

NOT SPECIFIED

15 mm

CMOS

1.5 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B196

Not Qualified

166.67 rpm

NO

MCF5274LCVM166

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

GRID ARRAY, LOW PROFILE

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

83 MHz

40

260

15 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

166 rpm

YES

e1

MCF5271CVM150

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

GRID ARRAY, LOW PROFILE

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

40

260

15 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

150 rpm

YES

e1

MCF5270CVM150

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

GRID ARRAY, LOW PROFILE

1.4 V

85 Cel

-40 Cel

TIN SILVER COPPER OVER NICKEL

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

40

260

15 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

150 rpm

YES

MCF5272CVF66

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

23

32

GRID ARRAY

3 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

1.75 mm

15 mm

YES

32

66 MHz

30

220

15 mm

CMOS

3.3 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

66 rpm

YES

e0

MCF5272VF66R2

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

23

32

GRID ARRAY

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

1.75 mm

15 mm

YES

32

66 MHz

30

220

15 mm

CMOS

3.3 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

66 rpm

YES

e0

MCF5274LVM166

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

24

32

GRID ARRAY, LOW PROFILE

1.4 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

83 MHz

40

260

15 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

166 rpm

YES

e1

MCF5272VF66

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

23

32

GRID ARRAY

3 V

70 Cel

0 Cel

BOTTOM

1.75 mm

15 mm

YES

32

66 MHz

30

220

15 mm

CMOS

3.3 V

1 mm

FIXED POINT

S-PBGA-B196

3

Not Qualified

66 rpm

YES

MIMXRT105SDVL6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.25 V

95 Cel

0

0 Cel

BOTTOM

1.43 mm

524288

10 mm

YES

0

24 MHz

10 mm

CMOS

105 mA

32

29

.65 mm

FLOATING-POINT

S-PBGA-B196

600 rpm

YES

R9A07G074M05GBG

Renesas Electronics

MICROPROCESSOR, RISC

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

8

26

64

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.05 V

125 Cel

16

-40 Cel

BOTTOM

1.43 mm

1048576

12 mm

YES

16

25 MHz

12 mm

CMOS

400 mA

1.1 V

32

8

.8 mm

FLOATING POINT

S-PBGA-B196

800 rpm

YES

R9A07G074M04GBG

Renesas Electronics

MICROPROCESSOR, RISC

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

8

26

64

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.05 V

125 Cel

16

-40 Cel

BOTTOM

1.43 mm

1048576

12 mm

YES

16

25 MHz

12 mm

CMOS

400 mA

1.1 V

32

8

.8 mm

FLOATING POINT

S-PBGA-B196

800 rpm

YES

R9A07G074M08GBG

Renesas Electronics

MICROPROCESSOR, RISC

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

8

26

64

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.05 V

125 Cel

16

-40 Cel

BOTTOM

1.43 mm

1048576

12 mm

YES

16

25 MHz

12 mm

CMOS

400 mA

1.1 V

32

8

.8 mm

FLOATING POINT

S-PBGA-B196

800 rpm

YES

R9A07G074M01GBG

Renesas Electronics

MICROPROCESSOR, RISC

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

8

26

64

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.05 V

125 Cel

16

-40 Cel

BOTTOM

1.43 mm

1048576

12 mm

YES

16

25 MHz

12 mm

CMOS

400 mA

1.1 V

32

8

.8 mm

FLOATING POINT

S-PBGA-B196

800 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.