196 Microprocessors 63

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MIMXRT1052DVL6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel		0	0 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz	40	260	10 mm		CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e1
MIMXRT1052DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel		0	0 Cel	TIN SILVER	BOTTOM	1.52 mm	524288	12 mm		YES	0	24 MHz	40	260	12 mm		CMOS	105 mA		32	29		.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e2
MIMXRT1064DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	85 Cel		0	0 Cel		BOTTOM	1.43 mm	1048576	10 mm		YES	0	24 MHz	40	260	10 mm		CMOS	110 mA		32	10		.65 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES
MIMXRT1051DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel		0	0 Cel	TIN SILVER	BOTTOM	1.52 mm	524288	12 mm		YES	0	24 MHz	40	260	12 mm		CMOS	105 mA		32	29		.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e2
MCF5372LCVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	80 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MCF5372LCVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY	BGA196,14X14,40		85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260			CMOS					Microprocessors	1 mm		S-PBGA-B196	3	Not Qualified	240 rpm
MIMXRT1064DVL6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	85 Cel		0	0 Cel		BOTTOM	1.43 mm	1048576	10 mm		YES	0	24 MHz	40	260	10 mm		CMOS	110 mA		32	10		.65 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES
MIMXRT1064DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel		0	0 Cel		BOTTOM	1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm		CMOS	110 mA		32	10		.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES
MIMXRT1051DVL6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel		0	0 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz	40	260	10 mm		CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e1
MIMXRT1064DVL6AR	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196.14X14,25	1.25 V	85 Cel			0 Cel		BOTTOM	1.43 mm	1048576	10 mm		YES			40	260	10 mm		CMOS	100 mA					.65 mm	FLOATING POINT	S-PBGA-B196	3		600 rpm	YES
MIMXRT1064DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel		0	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm		CMOS	110 mA		32	10		.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e1
MCF5272VM66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm		CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
ATSAMA5D21C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
MCF5272VM66R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32	3.3	GRID ARRAY	BGA196,14X14,40	3 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm		CMOS		3.3 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MIMXRT1052DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel		0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
SAM9X60D6K-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm		CMOS		1.8 V	16			.65 mm	FIXED POINT	R-PBGA-B196	3		600 rpm	YES	e1
ATSAMA5D225C-D1M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	65536	11 mm		YES	0	24 MHz			11 mm		CMOS		1.2 V	51	1		.75 mm	FIXED POINT	S-PBGA-B196			500 rpm	YES	e2
SAM9X60D6KT-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm		CMOS		1.8 V	16			.65 mm	FIXED POINT	R-PBGA-B196	3		600 rpm	YES	e1
ATSAMA5D22C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel		0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz			10 mm		CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
MCF5271CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MCF5208CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm		YES	32	40 MHz	40	260	15 mm		CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES	e1
ATSAMA5D225C-D1M-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel			-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	65536	11 mm		YES	0	24 MHz			11 mm		CMOS		1.2 V	51	1		.75 mm	FIXED POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D21C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
MCF5270VM100	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MCF5373LCVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY	BGA196,14X14,40		85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260			CMOS					Microprocessors	1 mm		S-PBGA-B196	3	Not Qualified	240 rpm
MCF5272CVM66	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm		CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MCF5275LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
MIMXRT1061DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel			0 Cel	TIN SILVER	BOTTOM	1.52 mm	1048576	12 mm		YES		24 MHz	40	260	12 mm		CMOS	110 mA		32	8		.8 mm	FLOATING POINT	S-PBGA-B196	3		600 rpm	YES	e2
MCF5270VM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	70 Cel			0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm		CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5271CVM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm		CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
ATSAMA5D22C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
MCF5232CVM150J	Freescale Semiconductor		INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel	COLDFIRE		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	65536	CMOS	150 mA				Microcontrollers	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES
MCF5270CVM150R2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF5327CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	80 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MCF5208CVM166J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32	40 MHz	40	260	15 mm		CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES
MCF53721CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	80 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
GD80960JA33	Intel	MICROPROCESSOR, RISC		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V			32	32	3.3,3.3/5	GRID ARRAY	BGA196(UNSPEC)	3.15 V						BOTTOM					YES	32	33.3 MHz					CMOS	320 mA	3.3 V			Microprocessors		FIXED POINT	S-PBGA-B196		Not Qualified	33 rpm	YES
ATSAMA5D22A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.1 V	85 Cel		1	-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	BOTTOM	1.2 mm	131072	11 mm		YES	32	24 MHz			11 mm		CMOS		1.2 V	51	1		.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel		1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm		CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
KU80386SLB1A20	Intel	MICROPROCESSOR, RISC		GULL WING	196	BQFP	SQUARE	PLASTIC/EPOXY		YES					32	3.3/5	FLATPACK	SPQFP196,1.5SQ							QUAD												CMOS	325 mA				Microprocessors	.635 mm		S-PQFP-G196		Not Qualified	20 rpm
MCF52277CVM160	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		15 mm		YES	32	66.67 MHz	40	260	15 mm		CMOS	.7 mA	1.5 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	NO	e1
MCF5232CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF54410CMF250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0			GRID ARRAY		1.14 V	85 Cel			-40 Cel		BOTTOM					YES	0						CMOS		1.2 V					FIXED POINT	S-PBGA-B196			250 rpm	YES
ADSP-21478KBCZ-ENG	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES				24			GRID ARRAY, LOW PROFILE, FINE PITCH			70 Cel			0 Cel		BOTTOM	1.5 mm		12 mm		YES	16				12 mm		CMOS						.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified	266 rpm	YES
ADSP-21479KBCZ-ENG	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES				24	32		GRID ARRAY, LOW PROFILE, FINE PITCH			70 Cel			0 Cel		BOTTOM	1.5 mm		12 mm		YES	16				12 mm		CMOS						.8 mm	FLOATING POINT	S-PBGA-B196		Not Qualified	266 rpm	YES
SCF5250VM120	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			25	32		GRID ARRAY, LOW PROFILE		1.08 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.86 MHz	40	260	15 mm		CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B196	3		120 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.