233 Microprocessors 6

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
SAM9X60D1G-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D1GT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D5MT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
SAM9X60D5M-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16		.8 mm	FIXED POINT	R-PBGA-B233	3	600 rpm	YES	e1
R7S721031VCBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	233	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA233,17X17,32	1.1 V	85 Cel	8	-40 Cel		BOTTOM	1.9 mm	3145728	15 mm		YES	32	13.33 MHz			15 mm	CMOS	492 mA	1.18 V	16	13	.8 mm	FLOATING POINT	S-PBGA-B233		400 rpm	YES
R7S721031VLBG	Renesas Electronics	MICROPROCESSOR, RISC		BALL	233	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA233,17X17,32	1.1 V	85 Cel	8	-40 Cel		BOTTOM	1.9 mm	3145728	15 mm		YES	32	13.33 MHz			15 mm	CMOS	492 mA	1.18 V	16	13	.8 mm	FLOATING POINT	S-PBGA-B233		400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.