255 Microprocessors 74

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC604ARX120	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	120 rpm
MPC604ARX100	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	100 rpm
MPC603PRX180LX	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V		BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	180 rpm	YES
MPC603PRX240LC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	240 rpm
MPC745CPX350	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V		BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	350 rpm	YES
MPC745BPX300	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V		BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	300 rpm	YES
MPC745CPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz	30	245	21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	350 rpm	YES	e0
MPC603RRX266LX	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V		BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	266 rpm	YES
MPC603RRX300LX	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V		BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	300 rpm	YES
MPC603PRX233LC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	233 rpm
MPC604ERX166	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5/3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	166 rpm
MPC604ERX333	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	1.9,3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	333 rpm
MPC604ARX133	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	133 rpm
MPC604ERX225	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5/3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	225 rpm
MPC603PRX180LC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	180 rpm
MPC745BVT350	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V		BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	350 rpm	YES
MPC604ERX200	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5/3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	200 rpm
MPC603ERX100T	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	100 rpm
MPC745CVT350	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V		BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	350 rpm	YES
MPC603PRX160LC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	160 rpm
MPC603PRX225LX	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V		BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	225 rpm	YES
MPC745BVT300	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V		BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	300 rpm	YES
MPC603PRX225L	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50			BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	225 rpm
MPC745BPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V	Tin/Lead (Sn/Pb)	BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz	30	245	21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	350 rpm	YES	e0
MPC603RRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V		BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
MPC603RRX300TX	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V		BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	300 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.