255 Microprocessors 74

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
TSPC603RVGS12LC	Atmel	MICROPROCESSOR, RISC		UNSPECIFIED	255	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32	2.5,3.3	GRID ARRAY	BGA255,16X16,50	2.375 V			TIN LEAD	BOTTOM	3.84 mm	21 mm		YES	64	75 MHz			21 mm	CMOS	2.5 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-X255		Not Qualified	266 rpm	YES	e0
MPE603RRX300LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS	2.5 V		1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	300 rpm	YES
MPE603RRX300LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	300 rpm
MPE603RRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.7 MHz			21 mm	CMOS	2.5 V		1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
MPE603RRX266LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS	2.5 V		1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	266 rpm	YES
MPE603PRX166LX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V	70 Cel	0 Cel		BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	167 rpm	YES
MPE603ERX133LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V				BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS	3.3 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	133.33 rpm	YES
MPE603RRX133LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	133 rpm
MPE603ERX133TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V				BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS	3.3 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	133.33 rpm	YES
MPE603RRX100LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	100 rpm
MPE603RRX166LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	166 rpm
XPC745BPX350LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V				GRID ARRAY		1.9 V				BOTTOM				YES						CMOS	2 V			FIXED POINT	R-PBGA-B255			350 rpm	NO
MPE603ERX100TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V				BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS	3.3 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	100 rpm	YES
MPE603ERX100LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V				BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS	3.3 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	100 rpm	YES
XPC745BPX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V				GRID ARRAY		1.9 V				BOTTOM				YES						CMOS	2 V			FIXED POINT	R-PBGA-B255			300 rpm	NO
MPE603PRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V	70 Cel	0 Cel		BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
MPC603PRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
MPC603PRX240LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	240 rpm	YES
MPC603RRX266TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	266 rpm	YES
MPC603RZT200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	2.6 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			23 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	200 rpm	YES
MPC745BVT350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	350 rpm	YES	e2
MPC603RZT200TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	2.6 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			23 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	200 rpm	YES
MPC755BPX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,2.5/3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B255		Not Qualified	400 rpm
MPC603PRX240L	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	240 rpm
MPC604ERX266XX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32		GRID ARRAY		1.8 V				BOTTOM	3.3 mm	21 mm		YES	64				21 mm	CMOS	1.9 V		1.27 mm	FLOATING POINT	S-CBGA-B255			266 rpm	NO
MPC603PRX160LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	160 rpm	YES
MPC745BVT300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V			TIN SILVER	BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz	40	260	21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	300 rpm	YES	e2
MPC604ERX300XX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32		GRID ARRAY		1.8 V				BOTTOM	3.3 mm	21 mm		YES	64				21 mm	CMOS	1.9 V		1.27 mm	FLOATING POINT	S-CBGA-B255			300 rpm	NO
MPC603PRX225LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	225 rpm
MPC603PRX200L	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	200 rpm
MPC603ERX133T	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	133 rpm
MPC745BPX350	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	350 rpm	YES
MPC604ERX300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	1.9,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	300 rpm
MPC603PRX166LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	166 rpm
MPC603ERX133TX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA255,16X16,50	3.135 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	133.33 MHz			21 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	133 rpm	YES	e0
MPC604ERX233	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5/3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	233 rpm
MPC755BRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2,2.5/3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	400 rpm
MPC603PRX220LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	220 rpm	YES
MPC604ERX180	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5/3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	180 rpm
MPC604ERX333XX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32		GRID ARRAY		1.8 V				BOTTOM	3.3 mm	21 mm		YES	64				21 mm	CMOS	1.9 V		1.27 mm	FLOATING POINT	S-CBGA-B255			333 rpm	NO
MPC603ERX133L	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS	3.3 V	Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	133 rpm
MPC603PRX220LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	220 rpm
MPC603PRX166LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	166 rpm	YES
MPC604ERX266	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	1.9,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	266 rpm
MPC603PRX200LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50					BOTTOM										CMOS		Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	200 rpm
MPC603PRX233LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V				BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS	2.5 V		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	233 rpm	YES
MPC745BPX300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V			TIN LEAD	BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	300 rpm	YES	e0
MPC603ERX100LX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA255,16X16,50	3.135 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	100 MHz			21 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	100 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.