NXP Semiconductors - MPC755BPX400LE

MPC755BPX400LE by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC755BPX400LE
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
In Stock3,496
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
No. of Terminals: 255
Qualification: Not Qualified
Package Equivalence Code: BGA255,16X16,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B255
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Terminal Pitch: 1.27 mm
Power Supplies (V): 2,2.5/3.3
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
3,496 - -

Popular Products

Category Top Products