NXP Semiconductors - MPC603ERX133T

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MPC603ERX133T by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC603ERX133T
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-XBGA-B255;
Datasheet MPC603ERX133T Datasheet
In Stock3,746
NAME DESCRIPTION
Package Body Material: CERAMIC
Speed: 133 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Nominal Supply Voltage: 3.3 V
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
No. of Terminals: 255
Qualification: Not Qualified
Package Equivalence Code: BGA255,16X16,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-XBGA-B255
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Terminal Pitch: 1.27 mm
Power Supplies (V): 3.3
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