NXP Semiconductors - MPC745BPX300LE

MPC745BPX300LE by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC745BPX300LE
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
In Stock1,679
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2 V
Integrated Cache: YES
Maximum Seated Height: 2.8 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 255
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B255
Maximum Clock Frequency: 100 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Speed: 300 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 2.1 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Length: 21 mm
Additional Features: ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Terminal Pitch: 1.27 mm
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,679 $292.020 $490,301.580

Popular Products

Category Top Products