NXP Semiconductors - MPC603ERX133TX

MPC603ERX133TX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC603ERX133TX
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 255; Package Code: BGA; Package Shape: SQUARE;
Datasheet MPC603ERX133TX Datasheet
In Stock1,889
NAME DESCRIPTION
Minimum Supply Voltage: 3.135 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Seated Height: 3 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 255
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-CBGA-B255
Maximum Clock Frequency: 133.33 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 21 mm
Speed: 133 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.465 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA255,16X16,50
Length: 21 mm
Additional Features: ALSO REQUIRES 3.3V I/O SUPPLY
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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