257 Microprocessors 13

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
STM32MP157AAD3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1000 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
STM32MP151DAD1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.3 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	48 MHz			10 mm	CMOS	955 mA	1.34 V	48	8	.65 mm	FLOATING POINT	S-PBGA-B257		800 rpm	YES
STM32MP151AAD3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	940 mA	1.2 V	48	8	.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
STM32MP157DAD1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		800 rpm	YES
FS32R274KSK2MMM	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	257	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V	8	ISO 26262		32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA257,17X17,32	1.19 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	1.51 mm	1572864	14 mm		YES		40 MHz	40	260	14 mm	CMOS	1642 mA	1.25 V	32		.8 mm	FLOATING-POINT	S-PBGA-B257	3	240 rpm	YES	e2
STM32MP157AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1000 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
STM32MP151DAD1T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.3 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	48 MHz			10 mm	CMOS	955 mA	1.34 V	48	8	.65 mm	FLOATING POINT	S-PBGA-B257		800 rpm	YES
STM32MP157DAD1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		800 rpm	YES
STM32MP157DAD3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	1000 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		800 rpm	YES
STM32MP157DAD3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	1000 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		800 rpm	YES
STM32MP151AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8			32	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm	"TERM PITCH-MAX"	YES		48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	100 mA	1.2 V	48	8	.65 mm	FLOATING-POINT	S-PBGA-B257		650 rpm	YES
STM32MP157AAD1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
STM32MP157AAD1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.