NXP Semiconductors - FS32R274KSK2MMM

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FS32R274KSK2MMM by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number FS32R274KSK2MMM
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 257; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet FS32R274KSK2MMM Datasheet
In Stock275
NAME DESCRIPTION
Minimum Supply Voltage: 1.19 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.25 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.51 mm
Surface Mount: YES
Maximum Supply Current: 1642 mA
Terminal Finish: TIN SILVER
On Chip Data RAM Width: 8
No. of Terminals: 257
Terminal Position: BOTTOM
Format: FLOATING-POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
No. of DMA Channels: 32
Screening Level: ISO 26262
Technology: CMOS
RAM Words: 1572864
JESD-30 Code: S-PBGA-B257
Maximum Clock Frequency: 40 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: LFBGA
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Other Names: NXPNXPFS32R274KSK2MMM
FS32R274KSK2MMM-ND
935372313557
2156-FS32R274KSK2MMM
568-14681
Speed: 240 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.31 V
No. of External Interrupts: 1
Low Power Mode: YES
Boundary Scan: YES
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA257,17X17,32
Length: 14 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
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