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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | FS32R274KSK2MMM |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 257; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES; |
Datasheet | FS32R274KSK2MMM Datasheet |
In Stock | 275 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.19 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.25 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.51 mm |
Surface Mount: | YES |
Maximum Supply Current: | 1642 mA |
Terminal Finish: | TIN SILVER |
On Chip Data RAM Width: | 8 |
No. of Terminals: | 257 |
Terminal Position: | BOTTOM |
Format: | FLOATING-POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
No. of DMA Channels: | 32 |
Screening Level: | ISO 26262 |
Technology: | CMOS |
RAM Words: | 1572864 |
JESD-30 Code: | S-PBGA-B257 |
Maximum Clock Frequency: | 40 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | LFBGA |
Width: | 14 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 240 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.31 V |
No. of External Interrupts: | 1 |
Low Power Mode: | YES |
Boundary Scan: | YES |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA257,17X17,32 |
Length: | 14 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |