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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | SPC5125YVN400R |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | SPC5125YVN400R Datasheet |
In Stock | 1,424 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER |
No. of Terminals: | 324 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Screening Level: | AEC-Q100 |
JESD-30 Code: | S-PBGA-B324 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA324,22X22,40 |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.4,3.3 |