MPC7410HX500LE by Freescale Semiconductor | Peripheral ICs

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Manufacturer	Freescale Semiconductor
Manufacturer's Part Number	MPC7410HX500LE
Description	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B360;
Datasheet	MPC7410HX500LE Datasheet
In Stock	140

NAME	DESCRIPTION
Minimum Supply Voltage:	1.7 V
Package Body Material:	CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage:	1.8 V
Integrated Cache:	YES
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	3.2 mm
Sub-Category:	Microprocessors
Surface Mount:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	360
Terminal Position:	BOTTOM
Format:	FLOATING POINT
Package Style (Meter):	GRID ARRAY, HEAT SINK/SLUG
Address Bus Width:	32
Technology:	CMOS
JESD-30 Code:	S-CBGA-B360
Maximum Clock Frequency:	133 MHz
Package Shape:	SQUARE
Terminal Form:	BALL
Package Code:	HBGA
Width:	25 mm
Moisture Sensitivity Level (MSL):	1
Speed:	500 rpm
Peripheral IC Type:	MICROPROCESSOR, RISC
Maximum Supply Voltage:	1.9 V
Low Power Mode:	YES
Boundary Scan:	YES
External Data Bus Width:	64
Bit Size:	32
JESD-609 Code:	e0
Qualification:	Not Qualified
Package Equivalence Code:	BGA360,19X19,50
Length:	25 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Power Supplies (V):	1.8,1.8/3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
140	$318.415	$44,578.044

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