Texas Instruments - OMAP3530ECBBA

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OMAP3530ECBBA by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number OMAP3530ECBBA
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE;
Datasheet OMAP3530ECBBA Datasheet
In Stock534
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .9 mm
Sub-Category: Graphics Processors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 515
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B515
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: VFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Speed: 720 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA515,28X28,16
Length: 12 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.1,1.2,1.8,1.8/3
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