352 Microprocessors 34

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8245LVV266D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e1
XPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.375 V	105 Cel	5	0 Cel		BOTTOM	1.65 mm	35 mm		YES	64	66 MHz			35 mm	CMOS	2.5 V	2		1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
XPC8245TZU300B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	32		GRID ARRAY	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel		BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32				35 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B352			300 rpm	YES
XPC8240LVV200E	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	200 rpm	YES	e1
XPC8240RVV250E	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	250 rpm	YES	e1
XPC8245TZU266B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	32		GRID ARRAY	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel		BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32				35 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B352			266 rpm	YES
XPC8240RZU250E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.75 V		32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.5 V	105 Cel		0 Cel		BOTTOM	1.65 mm	35 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66 MHz			35 mm	CMOS	2.625 V			1.27 mm	FLOATING POINT	S-PBGA-B352			250 rpm	YES
MPC8245TZU266D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32	66 MHz	30	220	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e0
MPC8245LZU350D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	350 rpm	YES	e0
MPC8245TZU333D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e0
MPC8245LZU266D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e0
MPC8245RZU400D	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V				TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz			35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	400 rpm	YES	e0
MPC8240RZU250	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES				32	2.5/2.75,3.3	GRID ARRAY	BGA352,26X26,50						BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B352		Not Qualified	250 rpm
MPC8245LVV333D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e1
MPC8245TVV333D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e1
MPC8245TVV266D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32	66 MHz	30	245	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e1
MPC8245LZU266A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V					BOTTOM	1.65 mm	35 mm		YES	32	66 MHz			35 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B352			266 rpm	YES
MPC8240RZU200X	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V	105 Cel		0 Cel		BOTTOM	1.65 mm	35 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66 MHz			35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	200 rpm	YES
MPC8245TVV300D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32	66 MHz	30	245	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	300 rpm	YES	e1
MPC8245LZU300D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	300 rpm	YES	e0
MPC8245LVV350D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	350 rpm	YES	e1
MPC8245LZU333D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e0
MPC8245TZU300D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32	66 MHz	30	220	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	300 rpm	YES	e0
MPC8240LZU200X	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V			32		GRID ARRAY, LOW PROFILE		2.375 V	105 Cel		0 Cel		BOTTOM	1.65 mm	35 mm		YES	64				35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MPC8245TVV350D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	350 rpm	YES	e1
MPC8245LVV300D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	300 rpm	YES	e1
MPC8245TZU350D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS	2 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	350 rpm	YES	e0
MPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V	105 Cel		0 Cel		BOTTOM	1.65 mm	35 mm		YES	64	66 MHz			35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MPC8240LZU250X	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V					BOTTOM	1.65 mm	35 mm		YES	64	66 MHz			35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352			250 rpm	YES
MPC8245ARZU466D	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V			32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2 V	85 Cel		0 Cel		BOTTOM	1.65 mm	35 mm					30	220	35 mm	CMOS	2.1 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	466 rpm	YES
MPC8240RVV250	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES				32	2.5	GRID ARRAY	BGA352,26X26,50						BOTTOM										CMOS	2.5 V		Microprocessors	1.27 mm		S-PBGA-B352		Not Qualified	250 rpm
MPC8240RZU250X	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V			32		GRID ARRAY, LOW PROFILE		2.375 V	105 Cel		0 Cel		BOTTOM	1.65 mm	35 mm		YES	64				35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352			250 rpm	YES
HD64404BTV	Renesas Electronics	MICROPROCESSOR, RISC		BALL	352	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.6 V		32			GRID ARRAY, FINE PITCH		1.4 V				TIN SILVER COPPER	BOTTOM	1.8 mm	23 mm		YES	32	33.33 MHz	20	260	23 mm	CMOS	1.5 V			.8 mm	FIXED POINT	S-PBGA-B352	3	Not Qualified	100 rpm	YES	e1
UPD65949S1-P00-F6	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		GRID ARRAY		3 V	85 Cel		-40 Cel		BOTTOM	2.58 mm	35 mm	IT ALSO OPERATES AT 5V	YES	32				35 mm	MOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	91 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.