357 Microprocessors 232

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC860PCZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			32		GRID ARRAY			95 Cel	-40 Cel		BOTTOM					80 MHz				CMOS				FIXED POINT	S-PBGA-B357			80 rpm
MPC860DPCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860PVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC860DPZQ50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC862PVR66B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES	e1
MPC857TZP100B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel	0 Cel		BOTTOM										3.3 V	Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	100 rpm
MPC857DSLZP50B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel	0 Cel		BOTTOM										3.3 V	Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	50 rpm
MPC857TCZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		115 Cel	-40 Cel		BOTTOM										3.3 V	Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	66 rpm
MPC860SRZQ50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC885VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32		40	260	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC860PCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		-40 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC857TZQ100B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		100 rpm	YES	e0
MPC862PCZQ66B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			Tin/Lead (Sn/Pb)	BOTTOM	2.05 mm	25 mm	YES	32	33 MHz	30	245	25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		100 rpm	YES	e0
MPC859PVR133A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC859DSLCZP66A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32		30	220	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC8241LVR166D	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V			TIN SILVER COPPER	BOTTOM	2.56 mm	25 mm	YES	64	66 MHz	30	245	25 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	166 rpm	YES	e1
MPC8241LZQ200D	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V			TIN LEAD	BOTTOM	2.56 mm	25 mm	YES	64	66 MHz	40	260	25 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	200 rpm	YES	e0
MPC862TZP80B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel	0 Cel		BOTTOM										3.3 V	Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	80 rpm
MPC859DSLZP66A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V				BOTTOM	2.52 mm	25 mm	YES	32	66.67 MHz			25 mm	CMOS	1.8 V		1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
KMPC885CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V				BOTTOM	2.52 mm	25 mm	YES	32	66 MHz			25 mm	CMOS	1.8 V		1.27 mm	FIXED POINT	S-PBGA-B357			133 rpm	YES
MPC862TCVR50B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		50 rpm	YES	e1
MPC855TCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC866TZP100A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32		30	220	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e0
MPC860PZQ80D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC860DTVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860DTVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC859DSLCZP50A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32		30	220	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC862PVR100B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.05 mm	25 mm	YES	32	33 MHz	30	245	25 mm	CMOS	3.3 V		1.27 mm	FLOATING POINT	S-PBGA-B357	3		100 rpm	YES	e1
MPC860DPZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		0 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC857TCVR66B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES	e1
MPC885VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32		40	260	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC857TZP80B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel	0 Cel		BOTTOM										3.3 V	Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	80 rpm
MPC866TVR133A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC862PZQ100B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	105 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.05 mm	25 mm	YES	32	33 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e0
MPC885CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32		40	260	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC862PCVR80B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		80 rpm	YES	e1
MPC860SRVR50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860DECVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC885CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V			Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm	YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC859PVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V				BOTTOM	2.52 mm	25 mm	YES	32	50 MHz	30	245	25 mm	CMOS	1.8 V		1.27 mm	FIXED POINT	S-PBGA-B357			100 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.