357 Microprocessors 232

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
KMPC866TZP133A	Motorola	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		32	32		GRID ARRAY					BOTTOM	2.52 mm	25 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	32	133 MHz			25 mm	CMOS	1.8 V		1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	133 rpm	YES
MPC860SRCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC885VR133	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC880CVR133	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC860DEVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
XPC860TZP50D4	Motorola	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	0 Cel		BOTTOM	2.05 mm	25 mm		YES	32	50 MHz			25 mm	CMOS	3.3 V	Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
MPC860PCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	-40 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860PZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC860SRVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860TCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	-40 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860TZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
KMPC885VR133	Freescale Semiconductor	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC860TVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC860ENVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CVR66	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CZP133	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880CZP66	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V			BOTTOM	2.52 mm	25 mm		YES	32	66.67 MHz	30	245	25 mm	CMOS	1.8 V		1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES
MPC880VR133	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC880VR66	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880VR80	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC880ZP133	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880ZP66	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860PCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC880ZP80	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC8241LVR266D	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V		TIN SILVER COPPER	BOTTOM	2.56 mm	25 mm		YES	64	66 MHz	30	245	25 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	266 rpm	YES	e1
MPC860DEZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	0 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
XPC860SRZP50C1	Motorola	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	0 Cel	TIN LEAD	BOTTOM	2.05 mm	25 mm			32	50 MHz			25 mm	CMOS	3.3 V	Other Microprocessor ICs	1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
MPC860ENCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860DEZQ50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	0 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860ENCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
XPC860ENCZP50C1	Motorola	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	-40 Cel	TIN LEAD	BOTTOM	2.05 mm	25 mm			32	50 MHz			25 mm	CMOS	3.3 V	Other Microprocessor ICs	1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
KMPC880VR133	Freescale Semiconductor	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
KMPC885CVR133	Freescale Semiconductor	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm	CMOS	1.8 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
XPC860ENCZP50D4	Motorola	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V	-40 Cel		BOTTOM	2.05 mm	25 mm		YES	32	50 MHz			25 mm	CMOS	3.3 V	Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
MPC855TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V		TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V	Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
XPC862PZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
XPC857TZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
XPC862TZP80B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			80 rpm	YES
XPC857TZP80B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			80 rpm	YES
XPC8241TZP166B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.8,3.3	GRID ARRAY	BGA357,19X19,50			Tin/Lead (Sn/Pb)	BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	166 rpm		e0
XPC857TZP50B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			50 rpm	YES
XPC862PZP80B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			80 rpm	YES
XPC862TZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
XPC8241TZP200B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.8,3.3	GRID ARRAY	BGA357,19X19,50			Tin/Lead (Sn/Pb)	BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	200 rpm		e0
XPC857DSLZP50B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V			BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B357			50 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.