Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
HSPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
3000 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.62 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.28 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
YES |
64 |
100 MHz |
52.32 mm |
CMOS |
3.45 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.62 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.28 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
YES |
64 |
100 MHz |
52.32 mm |
CMOS |
3.45 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.6 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.3 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
YES |
64 |
75 MHz |
52.32 mm |
CMOS |
3000 mA |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.6 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.3 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
YES |
64 |
75 MHz |
52.32 mm |
CMOS |
3000 mA |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.62 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.28 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
YES |
64 |
100 MHz |
52.32 mm |
CMOS |
3.45 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.6 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.3 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
YES |
64 |
75 MHz |
52.32 mm |
CMOS |
3000 mA |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.62 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.28 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
YES |
64 |
100 MHz |
52.32 mm |
CMOS |
3.45 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.6 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.3 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
YES |
64 |
75 MHz |
52.32 mm |
CMOS |
3000 mA |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2200 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1500 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
HSPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2300 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2900 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.45 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
3200 mA |
3.45 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
200 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
NO LEAD |
447 |
LGA |
SQUARE |
CERAMIC |
YES |
64 |
5 |
GRID ARRAY |
LGA447,39X39 |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
2300 mA |
5 V |
Microprocessors |
2.54 mm |
S-XBGA-N447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.45 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
4000 mA |
3.45 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
250 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
TIN LEAD |
PERPENDICULAR |
CMOS |
2800 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-PPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1500 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
TIN LEAD |
PERPENDICULAR |
CMOS |
2400 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-PPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
CACHE COHERENCY |
YES |
64 |
100 MHz |
52.324 mm |
CMOS |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
NO |
e0 |
||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1900 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1600 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2300 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2400 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2900 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1900 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
3200 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2400 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
YES |
64 |
88 MHz |
52.324 mm |
CMOS |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
88 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2400 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2200 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
TIN LEAD |
PERPENDICULAR |
CMOS |
2000 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-PPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
TIN LEAD |
PERPENDICULAR |
CMOS |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
100 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
YES |
64 |
100 MHz |
52.324 mm |
CMOS |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
NO |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
150 MIPS; 8 PIPELINE STAGES; CACHE COHERENCY |
YES |
64 |
75 MHz |
52.324 mm |
CMOS |
2800 mA |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
NO |
e0 |
|||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2400 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2300 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
8 PIPELINE STAGES |
YES |
64 |
67 MHz |
52.324 mm |
CMOS |
2400 mA |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
67 rpm |
NO |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.