Toshiba - TC86R4400SC-67

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

The NXP Semiconductors MIMXRT1024CAG4A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

The NXP Semiconductors MPC852TVR100A is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66 MHz. It features a low power mode and supports an external data bus width of 32 bits. Ideal for applications requiring high-speed processing in compact devices.

Intel's AT80612002931ABSLBWG is a 64-bit microprocessor with 1366 terminals and CMOS technology. Operating at speeds up to 1730 rpm, it consumes 0.75/1.35 V power supplies and has a max supply current of 100000 mA. Ideal for high-performance computing applications requiring advanced processing capabilities.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);

AM3354BZCZ30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With 64 DMA channels, it is ideal for use in devices requiring high-speed data processing.

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;

NXP Semiconductors' MPC8313CVRAFFC microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66.67 MHz. Ideal for low power applications, it integrates cache memory and supports boundary scan testing.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

NXP Semiconductors' MPC860TCZQ66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for low power applications, it operates at a speed of 66 rpm and supports integrated cache memory. Suitable for various embedded systems requiring high processing capabilities.

STM32MP135AAF3 by STMicroelectronics is a 32-bit microprocessor with 8-bit RAM width, 26-bit address bus, and 16-bit external data bus. It operates at a max clock frequency of 48 MHz and has low power mode. Ideal for applications requiring high-speed processing in compact devices.

AM3354BZCZD80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Technology: CMOS;

STM32MP157DAD1 by STMicroelectronics is a 32-bit microprocessor with integrated cache, 64 MHz clock frequency, and 48 DMA channels. It is used in industrial applications for its low power mode, CMOS technology, and floating point format support.

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.