NXP Semiconductors - MCF5307CAI66B

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MCF5307CAI66B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCF5307CAI66B
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
In Stock7,230
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 4.1 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 208
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, FINE PITCH
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PQFP-G208
Maximum Clock Frequency: 33.33 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: FQFP
Width: 28 mm
Moisture Sensitivity Level (MSL): 3
Speed: 66 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.6 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e3
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP208,1.2SQ,20
Length: 28 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3
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