NXP Semiconductors - P1013NSN2LFB

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P1013NSN2LFB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P1013NSN2LFB
Description MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;
Datasheet P1013NSN2LFB Datasheet
In Stock2,385
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.46 mm
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 689
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B689
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: HBGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1067 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: 0 Cel
Length: 31 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Temperature Grade: OTHER
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