Texas Instruments - AM3894CCYG135

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AM3894CCYG135 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number AM3894CCYG135
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE;
Datasheet AM3894CCYG135 Datasheet
In Stock170
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.31 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
On Chip Data RAM Width: 8
No. of Terminals: 1031
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
No. of DMA Channels: 72
Address Bus Width: 28
Technology: CMOS
RAM Words: 65536
JESD-30 Code: S-PBGA-B1031
Maximum Clock Frequency: 27 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 95 Cel
Package Code: FBGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 4
Speed: 1200 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA1031,37X37,25
Length: 25 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Power Supplies (V): 1
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