516 Microprocessors 327

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8270CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8270CVRMIBA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V				BOTTOM	2.55 mm	27 mm		YES	64	266 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516			66.67 rpm	NO
KMPC8270CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		32			GRID ARRAY, HEAT SINK/SLUG		1.33 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS	1.4 V		1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8321ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8270VRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8321VRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313CVRAFFC	NXP Semiconductors	MICROPROCESSOR		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3		333 rpm	YES	e2
MPC8321VRADDC	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313EVRAFFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8270CZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V			TIN LEAD SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC5121YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		0	32		GRID ARRAY		1.33 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0		40	260	27 mm	CMOS	1.4 V		1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8323ECVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8323ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
SPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS	1.4 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
KMPC8270CZQMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8323EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		14			GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516			266 rpm	YES
KMPC8275CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8270ZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8313VRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8275CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8323EVRAFDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		14			GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516			333 rpm	YES
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS	1.4 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8321EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313ECVRAFFC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	-40 Cel	NICKEL GOLD	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e4
MPC8313ECVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313ECVRAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8313EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313ZQAFFC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e0
MPC8323EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V			TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313CVRAFFA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e1
MPC8250ACVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY		1.9 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8250AZQIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY		1.7 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64		30	245	27 mm	CMOS	1.8 V		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	200 rpm	NO	e0
MPC8280VRQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel	0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	NO
MPC8275VRSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8280ZQPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel	0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8250AVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY		1.9 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8247ZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		32	32		GRID ARRAY		1.425 V				BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8272CZQPIEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		32	32		GRID ARRAY		1.425 V	105 Cel	-40 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8250ACZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY		1.9 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8313ECVRAFFA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS	1 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e1
MPC8280VRTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel	0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8280VRBX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel	0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	66 rpm	NO
MPC8272CVRPIEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		32	32		GRID ARRAY		1.425 V	105 Cel	-40 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.