Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
GRID ARRAY |
1.425 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
300 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
-40 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
333 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
GRID ARRAY |
1.425 V |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
NO |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
0 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
83.33 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
375 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
-40 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
83.33 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
375 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
-40 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
300 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.2 V |
32 |
32 |
GRID ARRAY |
1.9 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
83.3 MHz |
27 mm |
CMOS |
2 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
291 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
100 rpm |
NO |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
14 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
266 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
GRID ARRAY |
1.425 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
-40 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
NO |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
OTHER |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
200 rpm |
NO |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
0 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
266 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
0 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
266 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
-40 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
100 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
450 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
450 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
OTHER |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
233 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
200 rpm |
NO |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
GRID ARRAY |
1.425 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
GRID ARRAY |
.95 V |
TIN LEAD |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
333 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
GRID ARRAY |
1.425 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.47 V |
0 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.33 V |
85 Cel |
-40 Cel |
BOTTOM |
2.55 mm |
27 mm |
YES |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
1.4 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B516 |
Not Qualified |
300 rpm |
YES |
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NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
70 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.67 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
233 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
GRID ARRAY |
1.425 V |
105 Cel |
0 Cel |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
266 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
.95 V |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
Not Qualified |
400 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.