525 Microprocessors 37

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
LS1020AXN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm	19 mm	YES	32				19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525		1000 rpm	YES
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020AXE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
T1023NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSE7MNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm	19 mm	YES	32				19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525		1200 rpm	YES
T1013NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NSE7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm	19 mm	YES	32				19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525		1000 rpm	YES
LS1020ASE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES
LS1020AXN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
T1013NSE7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NSE7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm	19 mm	YES	32				19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525		1000 rpm	YES
T1013NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
LS1020ASN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm	19 mm	YES	32				19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525		1000 rpm	YES
T1023NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
LS1020ASE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
T1013NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NSE7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.