NXP Semiconductors - T1023NSE7PQA

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T1023NSE7PQA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number T1023NSE7PQA
Description MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;
Datasheet T1023NSE7PQA Datasheet
In Stock83
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Maximum Supply Current: 5 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 525
No. of Serial I/Os: 5
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
No. of DMA Channels: 2
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B525
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Other Names: NXPNXPT1023NSE7PQA
935323559557
2156-T1023NSE7PQA
568-14890
T1023NSE7PQA-ND
Speed: 1400 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.03 V
No. of External Interrupts: 6
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 64
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA525,23X23,32
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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