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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | T2080NXN8P1B |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | T2080NXN8P1B Datasheet |
In Stock | 42 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 896 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B896 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1533 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Low Power Mode: | NO |
Boundary Scan: | NO |
Bit Size: | 64 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA896(UNSPEC) |
Peak Reflow Temperature (C): | 250 |
Temperature Grade: | INDUSTRIAL |