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Manufacturer | Freescale Semiconductor |
---|---|
Manufacturer's Part Number | XPC8240LZU200E |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage: 2.5 V; |
Datasheet | XPC8240LZU200E Datasheet |
In Stock | 4,924 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2.375 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.65 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Terminal Finish: | Tin/Lead/Silver (Sn/Pb/Ag) |
No. of Terminals: | 352 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Address Bus Width: | 32 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B352 |
Maximum Clock Frequency: | 66 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | LBGA |
Width: | 35 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 200 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 2.625 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
JESD-609 Code: | e0 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA352,26X26,50 |
Length: | 35 mm |
Additional Features: | ALSO REQUIRES 3.3V I/O SUPPLY |
Peak Reflow Temperature (C): | 220 |
Terminal Pitch: | 1.27 mm |
Power Supplies (V): | 2.5,3.3 |