Intel - CM8067702868416SR339

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.

Intel FH8065301487918SR1X7 microprocessor features 64-bit architecture, 16-bit address bus width, and 64 external data bus width. Suitable for high-performance computing applications due to its low power mode and integrated cache.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

Intel AV8063801149402SR0T6 is a 64-bit microprocessor with 1023 terminals in a grid array package. It features integrated cache, CMOS technology, and operates at 2800 rpm. Ideal for high-performance computing applications requiring fixed-point processing capabilities.

MCIMX6U6AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, with a package style of grid array and terminal finish of tin silver copper.

AM5728BABCXA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at max 38.4 MHz clock frequency. Ideal for industrial applications, it features a low power mode and operates in an extended temperature range from -40 to 105°C.

MC9328MXLVH15 by Motorola is a 32-bit microprocessor with integrated cache and 25-bit address bus width. It operates at a max clock frequency of 16 MHz, suitable for low power applications in commercial temperature grade environments. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

Intel BV80605001908AK/SLBJJ is a 64-bit microprocessor with 1156 terminals, operating at speeds up to 2800 rpm. It features CMOS technology, consumes 110000 mA max supply current at 0.65/1.4 V, and is ideal for applications requiring high processing power in a compact form factor.

The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

XAM5749ABZXEA by Texas Instruments is a microprocessor with integrated cache and a max clock frequency of 38.4 MHz. It has a square package, with 760 terminals and a low profile design. This microprocessor is commonly used in industrial applications due to its temperature grade and CMOS technology.

The Texas Instruments AM5749ABZXEA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105 °C with a max clock frequency of 38.4 MHz.

DM3730CUS100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.

Microprocessors;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;