668 Microprocessors 23

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MPC8358ECZQAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN LEAD

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e0

MPC8358VRADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER COPPER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e1

MPC8358ZQAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

Tin/Lead (Sn/Pb)

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e0

MPC8358EZQAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

Tin/Lead (Sn/Pb)

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e0

MPC8358EVRADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER COPPER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e1

MPC8358CVRADDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

266 rpm

YES

e2

MPC8358EVRAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358ZQADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN LEAD SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e0

MPC8358VRAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358ECVRADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER COPPER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e1

MPC8358VRAGDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358EZQADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN LEAD SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e0

MPC8358ECZQADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN LEAD SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e0

MPC8358CVRADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER COPPER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e1

MPC8358CVRAGDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358EVRAGDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA668,28X28,40

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358CVRAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358CZQADDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN LEAD SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

Not Qualified

266 rpm

YES

e0

MPC8358ECVRAGDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA668,28X28,40

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358ECVRAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e2

MPC8358VRADDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

266 rpm

YES

e2

MPC8358EZQAGDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA668,28X28,40

1.14 V

TIN LEAD

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e0

MPC8358ZQAGDDA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

668

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

Tin/Lead (Sn/Pb)

BOTTOM

2.46 mm

29 mm

YES

32

66.67 MHz

40

260

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B668

3

Not Qualified

400 rpm

YES

e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.